Electronic device package and package method thereof
An electronic device package including a substrate, a base film, a first seal, an electronic device and a second seal is provided. The first seal is disposed between the substrate and the base film and partially exposed by the base film. The electronic device is formed on the base film. The second seal disposed on the electronic device includes absorbents. A part of the second seal adheres to a part of the first seal exposed by the base film. The first seal and the second seal encapsulate the base film and the electronic device. The first seal and the second seal are the same host materials. A packaging method of an electronic device package is also provided.
1. An electronic device package, comprising:
a substrate;
a base film;
a first seal disposed between the substrate and the base film, wherein the first seal is partially exposed by the base film;
an electronic device formed on the base film; and
a second seal disposed on the electronic device, the second seal comprising absorbents, wherein a part of the second seal adhere to a part of the first seal exposed by the base film, the first seal and the second seal encapsulate the base film and the electronic device, and the first seal and the second seal are the same host materials.
2. The electronic device package according to claim 1 further comprising:
a circuit board comprising a plurality of conducting elements, wherein the circuit board is disposed on the second seal and the plurality of conducting elements are embedded in the second seal, and the plurality of conducting elements are electrically connected to the electronic device.
3. The electronic device package according to claim 1 , wherein the electronic device comprises a first electrode layer, a light emitting layer and a second electrode layer, and the light emitting layer is disposed between the first electrode layer and the second electrode layer.
4. The electronic device package according to claim 1 further comprising at least one barrier layer formed on at least one surface of the base film.
5. The electronic device package according to claim 4 , wherein a material of the at least one barrier layer comprises silicon oxides, silicon nitrides, or the combination thereof.
6. The electronic device package according to claim 4 , wherein a water vapour transmission rate (WVTR) of the at least one barrier layer is smaller than 10 −4 g/m 2 day at 60 degrees Celsius and a relative humidity of 90% for 1000 hours.
7. The electronic device package according to claim 1 , wherein the absorbents comprising sodium polyacrylate, sodium polyacrylonitrile, polyacrylamide, CaO, BaO, SrO, Al 2 O 3 , SiO 2 , SiO, zeolite, or the combination thereof.
8. The electronic device package according to claim 1 , wherein a refractive index of the first seal equals to or greater than a refractive index of the substrate.
9. The electronic device package according to claim 1 , wherein the first seal comprises light-scatters distributed therein.
10. The electronic device package according to claim 9 , wherein a particle size of the light-scatters ranges from 30 nm to 70 nm.
11. The electronic device package according to claim 9 , wherein a doping ratio of the light-scatters to the first seal is smaller than 70 wt %.
12. The electronic device package according to claim 9 , wherein a water vapour transmission rate (WVTR) of the second seal is smaller than 10 −4 g/m 2 day at 60 degrees Celsius and a relative humidity of 90% for 1000 hours.
13. The electronic device package according to claim 12 , wherein the water vapour transmission rate (WVTR) of the second seal is about 6 g/m 2 day at 60 degrees Celsius and a relative humidity of 90% after 1000 hours.
14. The electronic device package according to claim 9 , wherein the light-scatters comprising Al 2 O 3 particles, polysterene particles or the combination thereof.
15. A method for packaging an electronic device package, comprising:
adhering a base film to a substrate through a first seal between the substrate and the base film;
forming an electronic device on the base film, wherein the first seal is partially exposed by the base film and the electronic device;
providing a second seal on the electronic device and the first seal, wherein the second seal comprises absorbents distributed therein; and
adhering a part of the second seal to a part of the first seal exposed by the base film, the first seal and the second seal encapsulating the base film and the electronic device, wherein the first seal and the second seal are the same host materials.
16. The method according to claim 15 further comprising:
providing a circuit board comprising a plurality of conducting elements;
adhering the circuit board with the second seal, wherein the conducting elements are embedded in the second seal; and
laminating the circuit board onto the electronic device through the second seal, wherein the conducting elements are electrically connected to the electronic device.
17. The method according to claim 15 further comprising:
forming at least one barrier layer on at least one surface of the base film.
18. The method according to claim 15 , wherein the electronic device is deposited under room temperature.
19. The method according to claim 15 , wherein the absorbents are doped into the second seal after adhering the part of the second seal to the part of the first seal exposed by the base film.
20. The method according to claim 15 , wherein the absorbents are premixed with the host materials of the second seal before the second seal is provided on the electronic device and the first seal.