Methods and devices for stressing an integrated circuit

1. A device for stressing an integrated circuit, wherein

the integrated circuit to be stressed comprises an electronic chip in semi-conductive material and a housing, said electronic chip being mounted inside said housing such that said housing prevents mechanical access to the electronic chip,

the device comprising:

a non-destructive control module for determining structural characteristics of the integrated circuit;

a machine-tool for machining an aperture in the housing of the integrated circuit, said aperture being machined according to the structural characteristics determined by the non-destructive control module so as to allow mechanical access to a face of the electronic chip;

a thermally conductive coupling member, designed to be thermally coupled to a source of thermal stress during the stressing operation; and

the coupling member comprises an end whose geometry is suitable for being introduced into the aperture to be made in the housing of the integrated circuit, so as to thermally couple a coupling face of this end with said face of the electronic chip.

2. The device according to claim 1 , wherein the coupling member has a substantially tapered external volume between two substantially parallel faces; one of these faces is the coupling face and the other, with a surface area substantially greater than said coupling face, is designed to be thermally coupled to the source of thermal stress during the stressing operation.

3. The device according to claim 2 , further comprising a plurality of coupling members whose ends have different geometries.

4. The device according to claim 1 , further comprising a plurality of coupling members whose ends have different geometries.

5. The device according to claim 1 , wherein each coupling member comprises an internal duct emerging on the coupling face of its end, adapted to provide optical access to the electronic chip when the coupling face of this coupling member is applied against the non-working face of the electronic chip.

6. The device according to claim 1 , wherein the non-destructive control module is an X-ray module.

7. A method for stressing an integrated circuit, wherein the integrated circuit to be stressed comprising an electronic chip in semi-conductive material and a housing, said electronic chip being mounted inside said housing such that said housing prevents mechanical access to the electronic chip,

the method comprising:

a step of determining structural characteristics of the integrated circuit by a non-destructive control module;

a step of machining an aperture in the housing of the integrated circuit by a machine-tool, said aperture being machined according to the structural characteristics determined by the non-destructive control module so as to allow mechanical access to a face of the electronic chip;

a step of thermally coupling an end of a thermally conductive coupling member with the face of the electronic chip, by inserting said end into the aperture formed in the housing; and

a step of thermally stressing the electronic chip by means for a source of thermal stress thermally coupled to the coupling member.

8. The method according to claim 7 , further comprising a step of selecting a coupling member, from a plurality of coupling members with ends of different geometries, adapted to be introduced into the aperture of the housing.

9. The method according to claim 7 , further comprising a step of radiation stressing the electronic chip through the aperture formed in the housing of the integrated circuit, preferably via an internal duct of the coupling member; said internal duct emerges on the coupling face of the end of the coupling member.

10. The method according to claim 7 , wherein the non-destructive control module is an X-ray module.

11. A device for stressing an integrated circuit the device comprising a source of thermal stress and a source of radiation stress, wherein the integrated circuit to be stressed comprises an electronic chip in semi-conductive material, a heat sink and a housing, said electronic chip being mounted inside the housing and being thermally coupled to said heat sink which is accessible from the exterior of said housing, the device comprising:

a non-destructive control module for determining structural characteristics of the integrated circuit;

a machine-tool for machining an aperture in the heat sink of the integrated circuit, said aperture being machined according to the structural characteristics determined by the non-destructive control module so as to provide optical access to a face of the electronic chip; and

a thermally conductive coupling member, designed to be thermally coupled to the source of thermal stress and to an accessible part of the heat sink during the stressing of the integrated circuit, wherein

the coupling member has a geometry designed to maintain optical access to the aperture in the heat sink for the radiation stressing operation.

12. The device according to claim 11 , wherein the non-destructive control module is an X-ray module.

13. A method for stressing an integrated circuit, wherein

the integrated circuit to be stressed comprises an electronic chip in semi-conductive material, a heat sink and a housing, said electronic chip being mounted inside the housing and being thermally coupled to said heat sink which is accessible from the exterior of said housing,

the method comprising:

a step of determining structural characteristics of the integrated circuit by a non-destructive control module;

a step of machining an aperture in the housing of the integrated circuit by a machine-tool, said aperture being machined according to the structural characteristics determined by the non-destructive control module so as to allow mechanical access to a face of the electronic chip;

a step of thermally coupling a thermally conductive coupling member with an accessible part of the heat sink;

a step of thermally stressing the electronic chip by a source of thermal stress thermally coupled to the coupling member; and

a step of radiation stressing the face of the electronic chip through the aperture formed in the heat sink; the coupling member maintaining optical access to said aperture in the heat sink.

14. The method according to claim 13 , wherein the non-destructive control module is an X-ray module.