Intergrated circuit devices including an interfacial dipole layer
An integrated circuit device includes a first transistor structure formed in a memory region (e.g., an embedded memory region) of a die. The first transistor structure includes a substrate (e.g., a planar substrate of a planar FET or a fin of a FinFET) and a first gate. The first gate includes a dipole layer proximate to the substrate and a barrier layer proximate to the dipole layer. The integrated circuit device further includes a second transistor structure formed in a logic device region of the die. The second transistor structure includes a second gate that includes an interface layer, a dielectric layer, and a cap layer. The dielectric layer is formed between the cap layer and the interface layer.
1. An integrated circuit device, comprising:
a first transistor structure in a memory region of a die, the first transistor structure having a substrate and a first gate, the first gate including a dipole layer proximate to the substrate and a barrier layer proximate to the dipole layer; and
a second transistor structure in a logic device region of the die, the second transistor structure having a second gate, the second gate including an interface layer, a dielectric layer, and a cap layer, the dielectric layer between the cap layer and the interface layer.
2. The integrated circuit device of claim 1 , wherein the barrier layer is on the dipole layer and on the cap layer.
3. The integrated circuit device of claim 1 , wherein the dielectric layer includes hafnium oxide (HfO 2 ), the dipole layer includes hafnium silicon oxide (HfSiO 4 ), or both.
4. The integrated circuit device of claim 1 , wherein the first transistor structure comprises a first field effect transistor (FET), the substrate includes a substrate of the first FET, and the second transistor structure comprises a second FET.
5. The integrated circuit device of claim 4 , wherein the interface layer is proximate to a second substrate of the second FET.
6. The integrated circuit device of claim 1 , wherein a gate stack of the first gate includes:
a metal layer proximate to the barrier layer;
a second barrier layer proximate to the metal layer; and
a fill metal layer proximate to the second barrier layer.
7. The integrated circuit device of claim 6 , wherein a gate stack of the second gate includes:
the interface layer proximate to a second substrate;
the dielectric layer proximate to the interface layer;
the cap layer proximate to the dielectric layer;
the barrier layer proximate to the cap layer;
the metal layer proximate to the barrier layer;
the second barrier layer proximate to the metal layer; and
the fill metal layer proximate to the second barrier layer.
8. An integrated circuit device comprising:
means for storing one or more bits formed in a memory region of a die, the means for storing including a first gate that includes a dipole layer; and
means for performing a logical function formed in a logic device region of the die, the means for performing including a second gate, the second gate including an interface layer, a dielectric layer, and a cap layer, the dielectric layer proximate to the interface layer and between the cap layer and the interface layer.
9. The integrated circuit device of claim 8 , wherein a barrier layer is on the dipole layer and on the cap layer.
10. The integrated circuit device of claim 8 , wherein the dielectric layer includes hafnium oxide (HfO 2 ), the dipole layer includes hafnium silicon oxide (HfSiO 4 ), or both.
11. The integrated circuit device of claim 8 , wherein a gate stack of the first gate includes:
a metal layer proximate to a barrier layer;
a second barrier layer proximate to the metal layer; and
a fill metal layer proximate to the second barrier layer.
12. The integrated circuit device of claim 11 , wherein a gate stack of the second gate includes:
the interface layer proximate to a second substrate;
the dielectric layer proximate to the interface layer;
the cap layer proximate to the dielectric layer;
the barrier layer proximate to the cap layer;
the metal layer proximate to the barrier layer;
the second barrier layer proximate to the metal layer; and
the fill metal layer proximate to the second barrier layer.