Method of detaching sub-substrate from substrate

1. A method of detaching a sub-substrate from a substrate, the method comprising:

providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction;

inserting a separating member between the first sub-substrate and the first substrate to partially detach the first sub-substrate from the first substrate;

attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns;

lifting first pads among the plurality of pads, the first pads being arranged in a third direction diagonal with respect to the first and second directions;

lifting second pads among the plurality of pads, after lowering the first pads, at least two of the second pads being arranged in the second direction, and at least two of the second pads being arranged in the third direction; and

lifting third pads among the plurality of pads, the third pads being arranged in the second direction.

2. The method as claimed in claim 1 , wherein:

the plurality of pads includes a fixing pad attached to an edge of the first sub-substrate, and

the method further comprises:

before lifting the first pads, separating the edge of the first sub-substrate from the first substrate by lifting the fixing pad; and

dropping the fixing pad back on the edge of the first sub-substrate, such that the first sub-substrate contacts the first substrate.

3. The method as claimed in claim 1 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

4. The method as claimed in claim 1 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

5. The method as claimed in claim 1 , further comprising:

providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and

combining the first substrate with the second substrate.

6. The method as claimed in claim 5 , wherein a thickness of the second substrate is about 0.01 mm to about 0.1 mm.

7. The method as claimed in claim 5 , wherein a thickness of the second sub-substrate is about 0.3 mm to about 0.7 mm.

8. The method as claimed in claim 1 , wherein:

lifting the second pads includes sequentially lifting at least first and second groups of second pads, after lowering the first pads, and

each of the first and second groups is lifted simultaneously, each of the first and second groups including two second pads arranged in the second direction and two second pads arranged in the third direction.

9. A method of detaching a sub-substrate from a substrate, the method comprising:

providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction;

inserting a separating member between the first sub-substrate and the first substrate to partially detach the first-sub substrate from the first substrate;

attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns;

substantially simultaneously lifting first pads and second pads among the plurality of pads, the first pads being adjacent to a first edge of the first substrate and being arranged in a third direction diagonal with respect to the first and the second directions, and the second pads being adjacent to a second edge of the first substrate and being arranged in the third direction, the first and second edges being on opposite sides of a diagonal of the rectangular shape of the first substrate.

10. The method as claimed in claim 9 , wherein:

the plurality of pads includes a first fixing pad attached to the first edge of the first sub-substrate, and a second fixing pad attached to the second edge of the first sub-substrate, and

the method further comprises:

before lifting the first and second pads, separating the first and second edges of the first sub-substrate from the first substrate by lifting the first fixing pad and the second fixing pad; and

dropping the first and second fixing pads back on the first and second edges of the first sub-substrate, respectively, such that the first and second sub-substrates contact the first and second substrates, respectively.

11. The method as claimed in claim 9 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

12. The method as claimed in claim 9 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

13. The method as claimed in claim 9 , further comprising:

providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and

joining the first substrate with the second substrate.

14. A method of detaching a sub-substrate from a substrate, the method comprising:

providing a first sub-substrate attached to a first substrate, the first substrate having a rectangular shape with first and second sides extending in a first direction and third and fourth sides extending in a second direction crossing the first direction;

inserting a separating member between the first sub-substrate and the first substrate to partially detach the first sub-substrate from the first substrate;

attaching a plurality of pads to the first sub-substrate, the plurality of pads being arranged in a matrix of a plurality of rows and a plurality of columns;

substantially simultaneously lifting first pads and second pads among the plurality of pads, the first pads being adjacent to a first edge of the first substrate and being arranged in a third direction diagonal with respect to the first and second directions, and the second pads being adjacent to a second edge and being arranged in the third direction, the first and second edges being on opposite sides of a diagonal of the rectangular shape of the first substrate; and

substantially simultaneously lifting third pads and fourth pads among the plurality of pads, the third pads being adjacent to the first edge, some of the third pads being arranged in the second direction, other of the third pads being arranged in the third direction, the fourth pads being adjacent to the second edge, some of the fourth pads being arranged in the second direction, and other of the fourth pads being arranged in the third direction.

15. The method as claimed in claim 14 , wherein:

the plurality of pads includes a first fixing pad attached to the first edge of the first sub-substrate and a second fixing pad attached to the second edge of the first sub-substrate, and

the method further comprises:

before lifting the first and second pads, separating the first and second edges of the first sub-substrate from the first substrate by lifting the first fixing pad and the second fixing pad; and

dropping the first and second fixing pads back on the first and second edges of the first sub-substrate, respectively, such that the first and second sub-substrates contact the first and second substrates, respectively.

16. The method as claimed in claim 14 , wherein a thickness of the first substrate is about 0.01 mm to about 0.1 mm.

17. The method as claimed in claim 14 , wherein a thickness of the first sub-substrate is about 0.3 mm to about 0.7 mm.

18. The method as claimed in claim 14 , further comprising:

providing a second substrate opposite to the first substrate and a second sub-substrate attached to the second substrate; and

joining the first substrate with the second substrate.