Semiconductor devices and methods of fabricating the same
A semiconductor device and a method for fabricating the same are disclosed. The semiconductor device comprises: a semiconductor substrate with an active area defined by a plurality of isolation features; a gate stack extending across the active area onto portions of the isolation features, wherein the gate stack comprising a gate dielectric layer on the active area and the portions of the isolation features, and a gate electrode on the gate dielectric layer; and a protective seal comprising a vertical portion lining sidewalls of the gate stack and a horizontal portion extending onto a top surface of the isolation features, wherein the horizontal portion surrounding portions of the gate stack outside the active area in a top view.
1. A semiconductor device, comprising:
a semiconductor substrate with an active area defined by a plurality of isolation features;
a gate stack extending across the active area onto portions of the isolation features, wherein the gate stack comprising a gate dielectric layer on the active area and the portions of the isolation features, and a gate electrode on the gate dielectric layer, wherein an edge portion of the gate dielectric layer is higher than a center portion of the gate dielectric layer; and
a protective seal comprising a vertical portion lining sidewalls of the gate stack and a horizontal portion extending onto a top surface of the isolation features, wherein the horizontal portion surrounding portions of the gate stack outside the active area in a top view.
2. The semiconductor device of claim 1 , wherein the isolation features are shallow trench isolation (STI) features.
3. The semiconductor device of claim 1 , wherein the gate dielectric layer comprises a high-k (HK) dielectric material.
4. The semiconductor device of claim 1 , wherein the gate dielectric layer is selected from the group consisting of: hafnium oxide, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide, aluminum oxide, hafnium dioxide-alumina (HfO 2 —Al 2 O 3 ) alloy, and combinations thereof.
5. The semiconductor device of claim 1 , wherein the gate electrode is a metal gate.
6. The semiconductor device of claim 1 , wherein the protective seal comprises silicon nitride, silicon oxynitride, or combinations thereof.
7. The semiconductor device of claim 1 , wherein the protective seal has a thickness of 1 to 40 nm.
8. A semiconductor device, comprising:
a semiconductor substrate with an active area defined by a plurality of shallow trench isolation (STI) features;
a gate stack extending across the active area onto portions of the shallow trench isolation (STI) features, wherein the gate stack comprising a high-k (HK) dielectric material on the active area and the portions of the shallow trench isolation (STI) features, and a gate electrode on the high-k (HK) dielectric material, wherein an edge portion of the high-k (HK) dielectric material is higher than a center portion of the high-k (HK) dielectric material; and
a protective seal comprising a vertical portion lining sidewalls of the gate stack and a horizontal portion extending onto a top surface of the shallow trench isolation (STI) features, wherein the horizontal portion surrounding portions of the gate stack outside the active area in a top view, and wherein the protective seal exposes a top surface of the gate stack.
9. The semiconductor device of claim 8 , wherein the gate electrode comprises a metal gate.
10. The semiconductor device of claim 8 , wherein the protective seal includes silicon nitride, silicon oxynitride, or combinations thereof.
11. The semiconductor device of claim 1 , the gate stack is formed in regions of the semiconductor substrate defined for NFET devices, for PFET devices, for high-resistance transistors, or for non-functional transistors.
12. The semiconductor device of claim 1 , wherein the active area comprises lightly doped source/drain regions (n-type and p-type LDD), gate spacers, source/drain (S/D) regions, silicide features, contact etch stop layer (CESL), and an interlayer dielectric (ILD).
13. The semiconductor device of claim 11 , wherein a strained structure is formed in the regions defined for PFET and NFET devices.
14. The semiconductor device of claim 1 , wherein the gate electrode is a metal gate.
15. The semiconductor device of claim 1 , wherein the gate stack comprises a high-k dielectric layer.
16. The semiconductor device of claim 1 , wherein a capping layer is formed on the gate dielectric layer.
17. The semiconductor device of claim 16 , wherein the gate electrode is formed on the capping layer.
18. The semiconductor device of claim 1 , wherein gate spacers are formed on the protective seal.
19. The semiconductor device of claim 18 , wherein a dielectric layer is formed on the protective seal, and the gate spacers are formed on the dielectric layer.
20. The semiconductor device of claim 1 , wherein the horizontal portion of the protective seal has a “ ” shape or a “ ” shape in a top view.