Semiconductor fin structures and methods for forming the same
A device includes a semiconductor substrate, and a plurality of semiconductor fins parallel to each other, wherein the plurality of semiconductor fins is a portion of the semiconductor substrate. A Shallow Trench Isolation (STI) region is on a side of the plurality of semiconductor fins. The STI region has a top surface and a non-flat bottom surface, wherein the plurality of semiconductor fins is over the top surface of the STI region.
1. A device comprising:
a semiconductor substrate;
a plurality of semiconductor fins parallel to each other, wherein the plurality of semiconductor fins is a portion of the semiconductor substrate;
a Shallow Trench Isolation (STI) region on a side of the plurality of semiconductor fins, wherein the STI region comprises a top surface and a non-flat bottom surface, and wherein the plurality of semiconductor fins is over the top surface of the STI region;
a plurality of STI regions in the semiconductor substrate;
a plurality of fin extensions underlying and aligned to the plurality of semiconductor fins, wherein sidewalls of the plurality of fin extensions are in contact with sidewalls of the plurality of STI regions; and
a fin extension residue having a bottom substantially level with bottom surfaces of the plurality of fin extensions, wherein the fin extension residue extends into the STI region from a bottom surface of the STI region.
2. The device of claim 1 , wherein the plurality of fin extensions has a first pitch, and wherein the fin extension residue and a nearest one of the plurality of semiconductor fins have a second pitch substantially equal to the first pitch.
3. The device of claim 1 , wherein the fin extension residue has a width substantially equal to a width of one of the plurality of fin extensions.
4. A device comprising:
a semiconductor substrate;
a plurality of Shallow Trench Isolation (STI) regions in the semiconductor substrate;
a plurality of semiconductor fins parallel to each other and in the semiconductor substrate;
a plurality of fin extensions underlying and aligned to the plurality of semiconductor fins, wherein the plurality of STI regions is disposed between the plurality of fin extensions;
an edge STI region on a side of the plurality of fin extensions, wherein the edge STI region comprises a first bottom surface substantially level with bottom surfaces of the plurality of STI regions, and a second bottom surface higher than the first bottom surface; and
a fin extension residue having a bottom substantially level with bottoms of the plurality of fin extensions, wherein the fin extension residue extends into the edge STI region, and wherein a top surface of the fin extension residue is in contact with the second bottom surface of the edge STI region.
5. The device of claim 4 , wherein the first bottom surface of the edge STI region comprises portions on opposite sides of the second bottom surface of the edge STI region.
6. The device of claim 4 , wherein the edge STI region comprises portions encircling the fin extension residue.
7. The device of claim 4 further comprising:
a gate dielectric on sidewalls and top surfaces of the plurality of semiconductor fins; and
a gate electrode over the gate dielectric, wherein the gate electrode overlaps the edge STI region.
8. The device of claim 4 , wherein the fin extension residue and a nearest one of the plurality of fin extensions have a pitch substantially equal to a pitch of the plurality of semiconductor fins.
9. The device of claim 4 , wherein the fin extension residue has a width substantially equal to a width of one of the plurality of fin extensions.