Semiconductor device comprising oxide semiconductor
To suppress change in electric characteristics and improve reliability of a semiconductor device including a transistor formed using an oxide semiconductor. A semiconductor device includes a transistor including a gate electrode, a first insulating film, an oxide semiconductor film, a second insulating film, and a pair of electrodes. The gate electrode and the oxide semiconductor film overlap with each other. The oxide semiconductor film is located between the first insulating film and the second insulating film and in contact with the pair of electrodes. The first insulating film is located between the gate electrode and the oxide semiconductor film. An etching rate of a region of at least one of the first insulating film and the second insulating film is higher than 8 nm/min when etching is performed using a hydrofluoric acid.
1. A semiconductor device comprising:
a transistor including:
a gate electrode;
a first insulating film;
an oxide semiconductor film;
a second insulating film; and
a pair of electrodes,
wherein the oxide semiconductor film is located between the first insulating film and the second insulating film,
wherein the oxide semiconductor film is in contact with the pair of electrodes,
wherein the first insulating film is located between the gate electrode and the oxide semiconductor film,
wherein silicon and oxygen are contained in at least one of the first insulating film and the second insulating film, and
wherein the at least one of the first insulating film and the second insulating film has an etching rate of higher than 10 nm/min when etching is performed using a hydrofluoric acid.
2. The semiconductor device according to claim 1 ,
wherein the gate electrode is located between a substrate and the oxide semiconductor film,
wherein the second insulating film over the oxide semiconductor film is in contact with a film,
wherein the second insulating film is located between the oxide semiconductor film and the film, and
wherein the film includes oxygen and at least one of indium, zinc, titanium, aluminum, tungsten, tantalum, and molybdenum.
3. The semiconductor device according to claim 1 ,
wherein the oxide semiconductor film is located between a substrate and the gate electrode,
wherein the transistor includes a third film,
wherein the third film is located between the first insulating film and the gate electrode, and
wherein the third film includes oxygen and at least one of indium, zinc, titanium, aluminum, tungsten, tantalum, and molybdenum.
4. The semiconductor device according to claim 1 ,
wherein the oxide semiconductor film is located between a substrate and the gate electrode,
wherein the second insulating film located between the substrate and the oxide semiconductor film is in contact with a fourth film,
wherein the fourth film is located between the second insulating film and the oxide semiconductor film, and
wherein the fourth film includes oxygen and at least one of indium, zinc, titanium, aluminum, tungsten, tantalum, and molybdenum.
5. The semiconductor device according to claim 1 ,
wherein a temperature of the hydrofluoric acid at the etching is 24° C., and
wherein a concentration of the hydrofluoric acid is 0.5 wt/vol %.
6. The semiconductor device according to claim 1 , wherein both of the first insulating film and the second insulating film have an etching rate of higher than 8 nm/min when etching is performed using the hydrofluoric acid.
7. The semiconductor device according to claim 1 ,
wherein both of the first insulating film and the second insulating film have an etching rate of higher than 10 nm/min when etching is performed using the hydrofluoric acid.
8. A display device comprising:
the semiconductor device according to claim 1 ; and
a pixel electrode,
wherein the pixel electrode is electrically connected to the transistor.
9. An input/output device comprising:
the semiconductor device according to claim 1 ; and
a touch panel,
wherein the touch panel is electrically connected to the semiconductor device.
10. A semiconductor device comprising,
a transistor including:
a gate electrode;
a first insulating film;
a first film;
an oxide semiconductor film;
a second insulating film; and
a pair of electrodes,
wherein the gate electrode is located between a substrate and the oxide semiconductor film,
wherein the first insulating film is located between the gate electrode and the oxide semiconductor film,
wherein the first film is located between the first insulating film and the oxide semiconductor film,
wherein the oxide semiconductor film is in contact with the pair of electrodes,
wherein the first film includes oxygen and at least one of indium, zinc, titanium, aluminum, tungsten, tantalum, and molybdenum, and
wherein at least one of the first insulating film and the second insulating film has an etching rate of higher than 8 nm/min when etching is performed using a hydrofluoric acid.
11. The semiconductor device according to claim 10 ,
wherein a temperature of the hydrofluoric acid at the etching is 24° C., and
wherein a concentration of the hydrofluoric acid is 0.5 wt/vol %.
12. The semiconductor device according to claim 10 , wherein both of the first insulating film and the second insulating film have an etching rate of higher than 8 nm/min when etching is performed using the hydrofluoric acid.
13. The semiconductor device according to claim 10 ,
wherein the at least one of the first insulating film and the second insulating film has an etching rate of higher than 10 nm/min when etching is performed using the hydrofluoric acid.
14. A display device comprising:
the semiconductor device according to claim 10 ; and
a pixel electrode,
wherein the pixel electrode is electrically connected to the transistor.
15. An input/output device comprising:
the semiconductor device according to claim 10 ; and
a touch panel,
wherein the touch panel is electrically connected to the semiconductor device.