Multi-coil module and electronic device
The loss is reduced even when loop coils of a multi-coil module are overlaid with each other. The multi-coil module includes a first coil module, having a first magnetic sheet and a first loop coil provided on the first magnetic sheet and wound in a planar shape, and a second coil module, having a second magnetic sheet and a second loop coil provided on the second magnetic sheet and wound in a planar shape. The first coil module and the second coil module are stacked on each other, and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other. The line width of the innermost coil pattern t of the first loop coil overlaid with the second loop coil is 1 mm or less.
1. A multi-coil module comprising:
a first coil module having a first magnetic sheet, and a first loop coil provided on the first magnetic sheet and wound in a planar shape; and
a second coil module having a second magnetic sheet, and a second loop coil provided on the second magnetic sheet and wound in a planar shape,
wherein the first coil module and the second coil module are stacked on each other, and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other,
a line width of the innermost coil pattern of the first loop coil overlaid with the second loop coil is 1 mm or less, and
the first loop coil is configured such that a pitch between outer coil patterns is smaller than a pitch between inner coil patterns.
2. A multi-coil module comprising:
a first coil module having a first magnetic sheet, and a first loop coil provided on the first magnetic sheet and wound in a planar shape; and
a second coil module having a second magnetic sheet, and a second loop coil provided on the second magnetic sheet and wound in a planar shape,
wherein the first coil module and the second coil module are stacked on each other, and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other,
a line width of the innermost coil pattern of the first loop coil overlaid with the second loop coil is less than a line width of a coil pattern located outside of the innermost coil pattern, and
the first loop coil is configured such that a pitch between outer coil patterns is smaller than a pitch between inner coil patterns.
3. The multi-coil module according to claim 1 , wherein the first loop coil is configured such that a line width of an outer coil pattern other than the innermost coil pattern is wider than the line width of the innermost coil pattern.
4. The multi-coil module according to claim 1 , wherein the first loop coil is formed to have the same width over the whole length.
5. The multi-coil module according to claim 1 , wherein the first loop coil has a slit formed in the coil pattern overlaid with the second loop coil, along that coil pattern.
6. The multi-coil module according to claim 1 , wherein the first loop coil is configured such that a coil pattern not overlaid with the second loop coil and a coil pattern overlaid with the second loop coil have different line widths and/or different pitches between coil patterns.
7. The multi-coil module according to claim 1 , wherein the second coil module is provided in an opening formed in the first magnetic sheet.
8. An electronic device having a multi-coil module incorporated in device housing,
wherein the multi-coil module includes:
a first coil module having a first magnetic sheet, and a first loop coil provided on the first magnetic sheet and wound in a planar shape; and
a second coil module having a second magnetic sheet, and a second loop coil provided on the second magnetic sheet and wound in a planar shape,
the first coil module and the second coil module are stacked on each other, and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other,
a line width of the innermost coil pattern of the first loop coil overlaid with the second loop coil is 1 mm or less, and
the first loop coil is configured such that a pitch between outer coil patterns is smaller than a pitch between inner coil patterns.
9. An electronic device having a multi-coil module incorporated in device housing,
wherein the multi-coil module includes:
a first coil module having a first magnetic sheet, and a first loop coil provided on the first magnetic sheet and wound in a planar shape; and
a second coil module having a second magnetic sheet, and a second loop coil provided on the second magnetic sheet and wound in a planar shape,
the first coil module and the second coil module are stacked on each other , and at least an innermost coil pattern of the first loop coil and the second loop coil are overlaid with each other,
a line width of the innermost coil pattern of the first loop coil overlaid with the second loop coil is less than a line width of a coil pattern located outside of the innermost coil pattern, and
the first loop coil is configured such that a pitch between outer coil patterns is smaller than a pitch between inner coil patterns.