Semiconductor device and method for fabricating the same
A semiconductor device and a method of fabricating the same, the semiconductor device including a fin structure, a first liner, a first insulating layer and a dummy gate structure. The fin structure is disposed on a substrate, where the fin structure has a trench. The first liner disposed in the trench. The first insulating layer disposed on the first liner. The dummy gate structure is disposed on the first insulating layer and disposed above the trench, where a bottom surface of the dummy gate and a top surface of the fin structure are on a same level.
1. A semiconductor device, comprising:
two adjacent fin structures disposed on a substrate, and a trench disposed between the two adjacent fin structures;
a first liner disposed in the trench;
a first insulating layer disposed on the first liner;
a shallow trench isolation disposed in the substrate and surrounding the two fin structures, wherein a bottom surface of the shallow trench isolation is higher than a bottom surface of the first insulating layer, and a top surface of the shallow trench isolation is lower than a top surface of the first insulating layer;
a dummy gate structure disposed on the first insulating layer and disposed right above the trench, wherein a bottom surface of the dummy gate structure and a top surface of the fin structure are on a same level; and
a first gate structure disposed on the fin structure and disposed on the shallow trench isolation simultaneously.
2. The semiconductor device according to claim 1 , wherein the dummy gate structure further comprises:
a dummy gate electrode disposed on the trench, wherein a portion of the dummy gate electrode is in the trench; and
a spacer disposed on the fin structure, surrounding the dummy gate electrode.
3. The semiconductor device according to claim 2 , further comprising:
a second liner disposed between the spacer of the dummy gate structure and the top surface of the fin structure.
4. The semiconductor device according to claim 1 , wherein a top surface of the first liner, a top surface of the first insulating layer and the top surface of the fin structure are on a same level.
5. The semiconductor device according to claim 1 , further comprising a contact etching stop layer disposed on the fin structure and on the dummy gate structure.
6. The semiconductor device according to claim 1 , further comprising at least one second gate structure disposed on the fin structure.
7. The semiconductor device according to claim 6 , further comprising at least one contact plug electrically contacted to the second gate structure.