IP Library Granted Patent US 9,659,691
Granted Patent B2
US 9,659,691 · App. 14/111,932 · Granted May 23, 2017

Thin-film thermistor element and method of manufacturing the same

Inventors: Kenji Ito (Tokyo, JP); Tadashi Toyoda (Tokyo, JP)
Assignee: SEMITEC CORPORATION
H01C7/041C22F1/14H01C7/04H01C17/075
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Quick Facts
Patent No.
US 9,659,691
App. No.
14/111,932
Granted
May 23, 2017
Kind
B2
Abstract

Provided is a thin-film thermistor element including a Si substrate 2 , a thermistor thin film 5 formed on the Si substrate 2 , and an electrode 3 made of platinum, an alloy thereof or the like and formed on, under or inside the thermistor thin film 5 . The electrode 3 is formed from a film deposited containing oxygen and nitrogen and then crystallized by heat treatment.

Claims (29)

1. A thin-film thermistor element comprising:

a base substance; a thermistor thin film formed on the base substance; and

at least one pair of electrodes formed on, under or inside the thermistor thin film, wherein

the one pair of electrodes each include an electrode layer made of platinum, an alloy thereof or the like, and

the electrode layer is in a crystalline state of crystal with <111> orientation only, and crystalline comprising at least one of oxygen and nitrogen.

2. The thin-film thermistor element according to claim 1 , wherein

the electrode layer is in a crystalline state of granular crystal with <111> orientation, and contains at least one of oxygen and nitrogen.

3. The thin-film thermistor element according to claim 2 , wherein

a content of the at least one of oxygen and nitrogen in the electrode layer is from 0.01% by weight to 4.9% by weight, both inclusive.

4. The thin-film thermistor element according to claim 1 , wherein

the electrode layer is in a crystalline state of columnar crystal with <111> orientation, and contains at least one of oxygen and nitrogen.

5. The thin-film thermistor element according to claim 1 , wherein

the electrode layer is in a crystalline state of granular crystal and columnar crystal with <111> orientation, and contains at least one of oxygen and nitrogen.

6. A method of manufacturing a thin-film thermistor element for forming a pair of electrodes by patterning on, under or inside a thermistor thin film formed on a base substance, the method comprising:

a first step comprising depositing an electrode layer;

a second step comprising forming at least one pair of electrodes by patterning; and

a third step comprising heat-treating the electrode layer to turn the electrode layer into a crystalline state;

wherein the electrode layer is in a crystalline state of crystal with <111> orientation only, and contains at least one of oxygen and nitrogen.

7. The method of manufacturing a thin-film thermistor element according to claim 6 , wherein

the first step includes depositing the electrode layer with at least one of oxygen and nitrogen added,

the heat treatment process in the third step turns the electrode layer into the crystalline state of granular crystal with <111> orientation.

8. The method of manufacturing a thin-film thermistor element according to claim 7 , wherein

a content of the at least one of oxygen and nitrogen in the electrode layer is from 0.01% by weight to 4.9% by weight, both inclusive.

9. The method of manufacturing a thin-film thermistor element according to claim 6 , wherein

the first step includes depositing the electrode layer with at least one of oxygen and nitrogen added,

the heat treatment process in the third step turns the electrode layer into the crystalline state of columnar crystal with <111> orientation.

10. The method of manufacturing a thin-film thermistor element according to claim 6 , wherein

the first step includes depositing the electrode layer with at least one of oxygen and nitrogen added,

the heat treatment process in the third step turns the electrode layer into the crystalline state of granular crystal and columnar crystal with <111> orientation.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2013
From: ITO, KENJI; TOYODA, TADASHI
To: SEMITEC CORPORATION
Reel/Frame 031407/0624 →
Priority Claims (1)
JP 2012-157278 · Jul 13, 2012 · national
Continuity (1)
Related Publication 20150170805A1 · Jun 18, 2015