Method and apparatus providing improved thermal conductivity of strain relaxed buffer
A structure includes a substrate and a strain relaxed buffer (SRB) that has a bottom surface disposed on the substrate and an opposite top surface. The SRB is formed to have a plurality of pairs of layers, where a given pair of layers is composed of a layer of Si 1-x Ge x and a layer of Si. The structure further includes a plurality of transistor devices formed above the top surface of the SRB and at least one contact disposed vertically through the top surface of the SRB and partially through a thickness of the SRB. The at least one contact is thermally coupled to at least one of the plurality of the Si layers for conducting heat out of the SRB via the at least one of the plurality of Si layers. A method to form the structure is also disclosed.
1. A method, comprising:
providing a substrate;
forming a strain relaxed buffer on a surface of the substrate, the strain relaxed buffer having a bottom surface disposed on the surface of the substrate and an opposite top surface, the strain relaxed buffer being formed to comprise of a plurality of pairs of layers, where a given pair of layers is composed of a layer of Si 1-x Ge x and a layer of Si;
forming a plurality of transistor devices above the top surface of the strain relaxed buffer; and
forming at least one contact through the top surface of the strain relaxed buffer and partially through a thickness of the strain relaxed buffer, the at least one contact being disposed transverse to a side of a fin of at least one transistor of the plurality of transistor devices, the at least one contact being thermally coupled to at least one of the plurality of the Si layers for conducting heat out of the strain relaxed buffer via the at least one of the plurality of Si layers.
2. The method as in claim 1 , further comprising growing a layer of dielectric material on the plurality of transistors and forming a thermal contact through the layer of dielectric material and connected to the contact for conducting heat from the contact to a top surface of the structure.
3. The method as in claim 1 , where there are about 5 to about 20 pairs of layers.
4. The method as in claim 1 , where the strain relaxed buffer has a thickness in a range of about 500 nm to about 2 μm, where there are about 5 to about 20 pairs of layers, and where the contact is comprised of a metal and is formed to a depth in the strain relaxed buffer in a range of about 350 nm to about 1.5 μm, and where the contact has a width in a range of about 30 nm to about 200 nm.
5. The method as in claim 1 , where a first one of the transistor devices is formed as an N-type FET that comprises at least one fin composed of tensile Si disposed on a first doped layer of Si 1-x Ge x of the strain relaxed buffer, and where a second one of the transistor devices is formed as a P-type FET that comprises at least one fin composed of compressive Si 1-x Ge x disposed on a second doped layer of Si 1-x Ge x of the strain relaxed buffer.
6. The method as in claim 5 , where a value of x in the compressive Si 1-x Ge x is greater than a value of x in the layers of Si 1-x Ge x in the strain relaxed buffer.
7. The method as in claim 1 , where a first one of the transistor devices is formed as an N-type FET that comprises at least one fin comprised of a layer of tensile Si disposed above a layer of Si 1-x Ge x that is doped P-type, and where a second one of the transistor devices is formed as a P-type FET that comprises at least one fin comprised of a layer of compressive Si 1-x Ge x that is disposed above a layer of Si 1-x Ge x that is doped N-type.
8. A method to operate an integrated circuit, comprising:
providing at least one transistor disposed above a multi-layered strain relaxed buffer comprised of alternating layers of Si 1-x Ge x and Si, the at least one transistor comprising at least one fin;
removing heat generated by the at least one transistor by transporting the heat laterally, primarily through one or more of the Si layers of the strain relaxed buffer, to a thermal conduit disposed vertically in the strain relaxed buffer, the thermal conduit being disposed transverse to a side of the at least one fin; and
transporting the heat vertically through the thermal conduit and away from the strain relaxed buffer towards a top surface of the integrated circuit.
9. The method as in claim 8 , where there are about 10 to about 40 layers in the strain relaxed buffer.
10. The method as in claim 8 , where the thermal conduit is comprised of a metal contained in a well contact that is electrically insulated from the multi-layered strain relaxed buffer by a well liner comprised of a dielectric material.
11. The method of claim 8 , where the strain relaxed buffer has a thickness in a range of about 500 nm to about 2 μm, and where the thermal conduit is comprised of a metal and is formed to a depth in the strain relaxed buffer in a range of about 350 nm to about 1.5 μm and has a width in a range of about 30 nm to about 200 nm.