Method for manufacturing light emitting device
A method for manufacturing a light emitting device has: forming a first phosphor layer including a first phosphor that is based on KSF or quantum dots on a light emitting element by a method other than spraying, and forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.
1. A method for manufacturing a light emitting device comprising:
mounting a light emitting element on a base member;
forming a light blocking member after the mounting of the light emitting element to cover at least a side surface of the light emitting element such that the light blocking member contacts with at least a part of the side surface of the light emitting element, the light blocking member including a resin;
forming a first phosphor layer after the forming of the light blocking member, the first phosphor layer including a first phosphor that is based on KSF or quantum dots on the light emitting element by a method other than spraying; and
forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.
2. The method of manufacturing the light emitting device according to claim 1 , wherein
the second phosphor is a phosphor with higher hardness than that of the first phosphor.
3. The method of manufacturing the light emitting device according to claim 1 , wherein
the first phosphor layer is formed by potting.
4. The method of manufacturing the light emitting device according to claim 1 , wherein
the second phosphor is a phosphor with better weather resistance than that of the first phosphor.
5. The method of manufacturing the light emitting device according to claim 1 , wherein
the first phosphor further includes at least one selected from the group consisting of materials based on CaS, SrGa 2 S 4 , SrAl 2 O 4 and CASN, and the second phosphor is at least one selected from the group consisting of materials based on garnet, β-SiAlON and chlorosilicate.
6. The method of manufacturing the light emitting device according to claim 1 , wherein
the second phosphor is a phosphor with higher water resistance than that of the first phosphor.
7. The method of manufacturing the light emitting device according to claim 1 , wherein
a concentration of the first phosphor contained in the first phosphor layer is less than a concentration of the second phosphor contained in the second phosphor layer.
8. The method of manufacturing the light emitting device according to claim 1 , wherein
the first phosphor and the second phosphor are in the form of particles, and the first phosphor has an average particle size that is larger than the average particle size of the second phosphor.
9. The method of manufacturing the light emitting device according to claim 1 , wherein
a thickness of the first phosphor layer is more than a thickness of the second phosphor layer.
10. The method of manufacturing the light emitting device according to claim 1 , wherein
a thickness of the first phosphor layer is 200 μm or less, and a thickness of the second phosphor layer is 100 μm or less.
11. The method of manufacturing the light emitting device according to claim 1 , wherein the forming of the light blocking member includes forming the light blocking member before the forming of the first phosphor layer, the light blocking member has a recess which exposes the light emitting element, and
the forming of the first phosphor layer includes forming the first phosphor layer on the light emitting element exposed via the recess.
12. The method of manufacturing the light emitting device according to claim 11 , wherein
the forming of the light blocking member includes forming the light blocking member to cover side surfaces of the light emitting element.
13. The method of manufacturing the light emitting device according to claim 11 , wherein
the forming of the first phosphor layer includes forming the first phosphor layer such that the sides of the first phosphor layer are covered by the light blocking member.
14. The method of manufacturing the light emitting device according to claim 11 , wherein
the forming of the second phosphor layer includes forming the second phosphor layer to cover an upper surface of the light blocking member.
15. The method of manufacturing the light emitting device according to claim 11 , wherein the forming of the light blocking member includes:
forming the light blocking member to a height that covers the light emitting element, and
selectively-removing part of an upper surface of the light blocking member to expose an upper surface of the light emitting element, whereby forming the recess which exposes the light emitting element.
16. The method of manufacturing the light emitting device according to claim 1 , further comprising
preparing a substrate including a base material provided with connection terminals that are electrically connected to the light emitting element, and
mounting the light emitting element on the substrate.
17. The method of manufacturing the light emitting device according to claim 1 , wherein
the first phosphor and the second phosphor are in the form of particles
an average particle size of the first phosphor and the second phosphor is 30 μm or less.
18. The method of manufacturing the light emitting device according to claim 1 , wherein
the first phosphor layer is formed with the first phosphor and a binder such that the concentration of the first phosphor at a position near the light emitting element is higher than that at other positions far from the light emitting element in the thickness direction of the first phosphor layer, and
the second phosphor layer is formed such that the concentration in which the second phosphor is contained in the second phosphor layer is substantially uniform.
19. The method of manufacturing the light emitting device according to claim 1 , wherein
the second phosphor layer is formed by laminating a plurality of layers.