Organosilicon compound-containing thermosetting composition and cured product thereof
The thermosetting composition of the present invention comprises 100 parts by mass of an organosilicon compound represented by a general formula (1) and 0.01 to 10 parts by mass of a polymerization initiator having a 10-hour half-life temperature in a range from 80° C. to 130° C. (In the formula (1), R 1 , R 2 , R 3 , R 4 and R 5 are each, independently, a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, a cycloaralkyl group having 9 to 12 carbon atoms, an aryl group having 6 to 10 carbon atoms or a group having an ethylenically unsaturated group; at least one of R 1 , R 2 , R 3 , R 4 and R 5 is a group having an ethylenically unsaturated group; R 6 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; v, w, x, y and z represent number of moles and are 0 or a positive number; at least one of w and x is a positive number; 0≦w/(v+x+y+z)≦10 is satisfied.)
1. A thermosetting composition comprising:
100 parts by mass of an organosilicon compound represented by a general formula (1); and
0.01 to 10 parts by mass of a polymerization initiator having a 10-hour half-life temperature in a range from 80° C. to 130° C.:
wherein in formula (1), R 1 , R 2 , R 3 , R 4 and R 5 are each, independently, a hydrogen atom, or a group having an alkyl group having 1 to 10 carbon atoms, an aralkyl group having 7 to 10 carbon atoms, a cycloalkyl group having 1 to 10 carbon atoms, a cycloaralkyl group having 9 to 12 carbon atoms, an aryl group having 6 to 10 carbon atoms or an ethylenically unsaturated group; at least one of R′, R 2 , R 3 , R 4 and R 5 is a group having an ethylenically unsaturated group; R 6 is a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; v, w, x, y and z represent number of moles and are 0 or a positive number; at least one of w and x is a positive number; 0≦w/(v+x+y+z)≦10 is satisfied, and
a proportion of an inorganic part in the organosilicon compound is 40% or higher by mass.
2. The thermosetting composition according to claim 1 , wherein said group having said ethylenically unsaturated group is represented by a general formula (2):
wherein in formula (2), R 7 is a hydrogen atom or a methyl group, and R 8 is an alkylene group having 1 to 6 carbon atoms.
3. The thermosetting composition according to claim 1 , wherein said polymerization initiator comprises an organic peroxide.
4. The thermosetting composition according to claim 1 , wherein w and x are both a positive number, and R′ is a group having an ethylenically unsaturated group in said formula (1) representing said organosilicon compound.
5. A cured product obtained by heating said thermosetting composition according to claim 1 .
6. The cured product of claim 5 , wherein a heating temperature of the thermosetting composition is in a range from 60° C. to 200° C.
7. The thermosetting composition according to claim 1 , wherein the polymerization initiator has a 10-hour half-life temperature in a range from 90° C. to 110° C.
8. The thermosetting composition according to claim 1 , wherein the polymerization initiator has a 10-hour half-life temperature in a range from 95° C. to 110° C.
9. The thermosetting composition according to claim 1 , wherein an amount of the polymerization initiator is in a range from 0.01 to 10 parts by mass based on 100 parts by mass of the organosilicon compound.
10. The thermosetting composition according to claim 1 , wherein an amount of the polymerization initiator is in a range from 0.1 to 8 parts by mass based on 100 parts by mass of the organosilicon compound.
11. The thermosetting composition according to claim 1 , wherein an amount of the polymerization initiator is in a range from 0.3 to 5 parts by mass based on 100 parts by mass of the organosilicon compound.
12. The thermosetting composition according to claim 1 , wherein the proportion of the inorganic part in the organosilicon compound is 43% or higher by mass.
13. The thermosetting composition according to claim 1 , wherein the proportion of the inorganic part in the organosilicon compound is 47% or higher by mass.
14. The cured product according to claim 5 , wherein a reaction rate of the ethylenically unsaturated bond included the ethylenically unsaturated group is 80% or more.
15. The cured product according to claim 5 , wherein a reaction rate of the ethylenically unsaturated bond included the ethylenically unsaturated group is 85% or more.
16. The cured product according to claim 5 , wherein a reaction rate of the ethylenically unsaturated bond included the ethylenically unsaturated group is 90% or more.