Heat sink for cooling of power semiconductor modules

1. A heat sink for cooling at least one power semiconductor module mounted to a first surface of a base plate, wherein the base plate includes a second surface opposite the first surface, the heat sink comprising:

a basin for containing a cooling liquid; and

a contact rim arranged around the basin, wherein the contact rim has a flat surface that slopes inwards to the basin, and wherein the flat surface of the contact rim receives the second surface of the base plate,

wherein the basin further comprises a recessed rim for receiving a gasket, wherein the recessed rim is arranged between the basin and the contact rim.

2. The heat sink of claim 1 , wherein the flat slope corresponds to a convex bending of the base plate of the at least one power semiconductor module.

3. The heat sink of claim 1 , wherein the angle of the flat slope is in the range of 0.1 degrees to 3 degrees.

4. The heat sink of claim 1 , wherein the angle of the flat slope is in the range of 0.5 degrees to 1.5 degrees.

5. The heat sink of claim 1 , wherein the basin has an inlet and an outlet for allowing circulation of the liquid coolant.

6. The heat sink of claim 1 , wherein the gasket is made with a double gasket containing an inner and an outer gasket.

7. The heat sink of claim 6 , wherein the gasket is made of EPDM rubber with a plastic carrier.

8. The heat sink of claim 1 , wherein the heat sink comprises at least two basins.

9. The heat sink of claim 1 , wherein the heat sink is made of a metal.

10. The heat sink of claim 1 , wherein the heat sink is made of molded plastic.

11. The heat sink of claim 10 , wherein the molded heat sink is made with a fibre reinforced plastic.

12. The heat sink of claim 1 , wherein the heat sink is made partly of plastic and partly of metal.

13. The heat sink of claim 1 , further comprising:

a flow distributing element inserted in the basin.