IP Library Granted Patent US 9,666,609
Granted Patent B2
US 9,666,609 · App. 14/469,554 · Granted May 30, 2017

Array substrate wiring and the manufacturing and repairing method thereof

Inventors: Chao Liu (Beijing, CN); Yujun Zhang (Beijing, CN); Zengsheng He (Beijing, CN); Lei Chen (Beijing, CN)
Assignee: BOE TECHNOLOGY GROUP CO., LTD.
H01L27/124H01L27/1259
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Quick Facts
Patent No.
US 9,666,609
App. No.
14/469,554
Granted
May 30, 2017
Kind
B2
Abstract

This disclosure relates to an array substrate wiring and manufacturing and repairing method thereof. The array substrate wiring comprises a first wiring formed on the substrate for transmitting electric signals; an insulating layer formed on the first wiring; a second wiring formed on the insulating layer, being opposite to the first wiring, the second wiring being in a hanging state and not transmitting electric signals. By means of such a double layer wiring structure, the holes produced in the insulating layer are blocked using the second wiring in the upper layer, such that the outside moisture cannot reach the first wiring via the holes in the insulating layer, thereby protecting the first wiring for transmitting electric signals from corrosion and scratch.

Claims (24)

1. An array substrate wiring comprising:

a first wiring formed on an substrate for transmitting electric signals;

an insulating layer formed on the first wiring;

a second wiring formed on the insulating layer for protecting the first wiring, being opposite to the first wiring, the second wiring being in a floating state,

wherein the first wiring comprises a scan line wiring located in a scan line wiring area and a data line wiring located in a data line wiring area, and the second wiring comprising a scan line protection wiring located in the scan line wiring area and a data line protection wiring located in the data line wiring area,

and wherein the first wiring is formed in synchronization with a gate metal layer, and the second wiring is formed in synchronization with a source drain metal layer, and the data line wiring is connected with the source drain metal layer through a transparent electrode layer.

2. The array substrate wiring according to claim 1 , wherein the line width of the second wiring is greater than that of the first wiring.

3. The array substrate wiring according to claim 1 , further comprising at least one protection wiring formed on the first wiring, being opposite to the first wiring and being electrically insulated from the first wiring, the at least one protection wiring being in a hanging state and not transmitting electric signals.

4. The array substrate wiring according to claim 2 , further comprising at least one protection wiring formed on the first wiring, being opposite to the first wiring and being electrically insulated from the first wiring, the at least one protection wiring being in a hanging state and not transmitting electric signals.

5. The array substrate wiring according to claim 1 , further comprising at least one protection wiring formed on the first wiring, being opposite to the first wiring and being electrically insulated from the first wiring, the at least one protection wiring being in a hanging state and not transmitting electric signals.

6. The array substrate wiring according to claim 3 , wherein the at least one protection wiring is formed in synchronization with a transparent electrode layer, and the line width of the at least one protection wiring is greater than that of the first wiring.

7. The array substrate wiring according to claim 4 , wherein the at least one protection wiring is formed in synchronization with a transparent electrode layer, and the line width of the at least one protection wiring is greater than that of the first wiring.

8. The array substrate wiring according to claim 5 , wherein the at least one protection wiring is formed in synchronization with a transparent electrode layer, and the line width of the at least one protection wiring is greater than that of the first wiring.

9. A method of repairing an array substrate wiring according to claim 1 , comprising the step of:

when the first wiring being in an open state, electrically communicating the first wiring with the second wiring so as to enable the second wiring to transmit electric signals.

10. An array substrate comprising an array substrate wiring according to claim 1 .

11. A display panel comprising an array substrate according to claim 10 .

12. A display device comprising a display panel according to claim 11 .

13. A method of manufacturing an array substrate wiring comprising the steps of:

forming a first wiring for transmitting electric signals on an substrate;

forming an insulating layer on the first wiring;

forming a second wiring for protecting the first wiring on the insulating layer, the second wiring being opposite to the first wiring, being in a floating state,

wherein the first wiring comprises a scan line wiring located in a scan line wiring area and a data line wiring located in a data line wiring area, and the second wiring comprising a scan line protection wiring located in the scan line wiring area and a data line protection wiring located in the data line wiring area,

and wherein the first wiring is formed in synchronization with a gate metal layer, and the second wiring is formed in synchronization with a source drain metal layer, and the data line wiring is connected with the source drain metal layer through a transparent electrode layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 26, 2014
From: LIU, CHAO; ZHANG, YUJUN; HE, ZHENGSHENG; CHEN, LEI
To: BOE TECHNOLOGY GROUP CO., LTD.
Reel/Frame 033615/0170 →
Priority Claims (1)
CN 2014 1 0234264 · May 29, 2014 · national
Continuity (1)
Related Publication 20150348994A1 · Dec 3, 2015