Integrated circuit heat dissipation using nanostructures
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.
1. A semiconductor structure, comprising:
a bipolar junction transistor comprising:
a collector formed in a substrate;
a base formed on the substrate and over the collector; and
an emitter formed on and over the base;
an isolation layer formed on and over a first portion of the base;
an electrically conductive layer formed on and over the isolation layer;
a plurality of nanowire structures formed on a surface of the electrically conductive layer above the first portion of the base, and
a base electrical contact formed over a second portion of the base.
2. The semiconductor structure of claim 1 , wherein the isolation layer comprises a high thermal conductivity material that electrically isolates the base from the electrically conductive layer.
3. The semiconductor structure of claim 1 , wherein the isolation layer comprises polymorphic ceramic.
4. The semiconductor structure of claim 1 , wherein the isolation layer comprises one of alumina (Al 2 O 3 ), boron nitride (BN), zirconia (ZrO 2 ), and aluminum nitride (AlN).
5. The semiconductor structure of claim 1 , wherein the electrically conductive layer comprises silicide on the isolation layer.
6. The semiconductor structure of claim 1 , wherein the plurality of nanowire structures comprises a plurality of spaced apart columnar structures each having a sub-micron width.
7. The semiconductor structure of claim 1 , further comprising:
an insulator layer on and around the plurality of nanowire structures; and
an electrical contact of the bipolar junction transistor in the insulator layer.
8. The semiconductor structure of claim 1 , wherein:
the collector and the emitter each comprise n-type semiconductor material; and
the base comprises p-type semiconductor material.
9. The semiconductor structure of claim 8 , wherein the substrate comprises doped silicon.
10. The semiconductor structure of claim 1 , further comprising shallow trench isolation structures formed in the substrate around the collector.
11. A method of forming semiconductor structure, comprising:
forming a bipolar junction transistor comprising:
forming a collector in a substrate;
forming a base on the substrate and over the collector; and
forming an emitter on and over the base;
forming an isolation layer on and over a first portion of the base;
forming an electrically conductive layer on and over the isolation layer;
forming a plurality of nanowire structures on a surface of the electrically conductive layer above the first portion of the base, and
forming a base contact over a second portion of the base.
12. The method of claim 11 , wherein the forming isolation layer comprises forming a high thermal conductivity material that electrically isolates the base from the electrically conductive layer.
13. The method of claim 11 , wherein the isolation layer comprises polymorphic ceramic.
14. The method of claim 11 , wherein the isolation layer comprises one of alumina (Al 2 O 3 ), boron nitride (BN), zirconia (ZrO 2 ), and aluminum nitride (AlN).
15. The method of claim 11 , wherein the forming electrically conductive layer comprises silicide on the isolation layer.
16. The method of claim 11 , wherein the forming the plurality of nanowire structures comprises forming a plurality of spaced apart columnar structures each having a sub-micron width.
17. The method of claim 11 , further comprising:
forming an insulator layer on and around the plurality of nanowire structures; and
forming an electrical contact of the bipolar junction transistor in the insulator layer.
18. The method of claim 11 , further comprising:
forming the plurality of nanowire structures on the electrically conductive layer by providing an electric current to the electrically conductive layer through a wiring path; and
forming a discontinuity in the wiring path after the plurality of nanowire structures are formed.