Micromechanical sensor unit and method for manufacturing micromechanical sensor units
A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.
1. A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, the method comprising:
configuring and joining the substrate and the sealing cap so that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are created;
creating a sealable channel leading into the first cavity;
changing the first pressure in the first cavity via the sealable channel;
sealing the sealable channel with a first sealing arrangement and/or a second sealing arrangement; and
implementing a recess for accommodating the first sealing arrangement;
wherein the first sealing arrangement is situated in the recess for accommodating the first sealing arrangement so that a further recess for accommodating the second sealing arrangement is implemented by the accommodation of the first sealing arrangement, and/or the second sealing arrangement is situated on the first sealing arrangement so that the first sealing arrangement is completely enclosed by the second sealing arrangement and by the micromechanical sensor unit.
2. The method of claim 1 , wherein, in the creating task, the sealable channel and/or the recess for accommodating the first sealing arrangement is/are implemented with the aid of an etching process, and/or only those areas of the first cavity are etched by the etching process for the implementation of the channel which are not an integral part of the first sensor element.
3. The method of claim 1 , wherein the first sealing arrangement at least partially includes a polymer and the second sealing arrangement at least partially includes a metal.
4. A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, the method comprising:
configuring and joining the substrate and the sealing cap so that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are created;
creating a sealable channel leading into the first cavity; and
changing the first pressure in the first cavity via the sealable channel;
wherein the micromechanical sensor unit includes a protective device for the creating task, the protective device including at least one of an etch stop layer, a sacrificial etching area, and a web.
5. A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, the method comprising:
configuring and joining the substrate and the sealing cap so that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are created;
creating a sealable channel leading into the first cavity;
changing the first pressure in the first cavity via the sealable channel;
sealing the sealable channel with a first sealing arrangement and/or a second sealing arrangement;
implementing a recess for accommodating the first sealing arrangement; and
structuring the second sealing arrangement.
6. A micromechanical sensor unit, comprising:
a first cavity, which has a first pressure and in which a first sensor element is situated; and
a second cavity, which has a second pressure and in which a second sensor element is situated;
wherein the first cavity has a sealable channel for establishing the first pressure in the first cavity;
wherein the sealable channel is sealed with a first sealing arrangement and/or with a second sealing arrangement; and
wherein the first sealing arrangement is situated in a recess for accommodating the first sealing arrangement so that a further recess for accommodating the second sealing arrangement is implemented by the accommodation of the first sealing arrangement, and/or the second sealing arrangement is situated on the first sealing arrangement so that the first sealing arrangement is completely enclosed by the second sealing arrangement and by the micromechanical sensor unit.
7. The micromechanical sensor unit of claim 6 , wherein the first sensor element and/or the second sensor element is/are a rotation rate sensor, an acceleration sensor, or a Lorentz force-based magnetic field sensor.