Process analytic device with improved thermal stability

1. A process analytic device comprising:

an input to receive a sample of interest;

an analytic detector operably coupled to receive the sample of interest and to provide an analytic output relative to the sample of interest; and

a plurality of heat pipes thermally coupled to the analytical detector, wherein each of the plurality of heat pipes are substantially straiaht and parallel to one another; and

wherein each of the heat pipes includes a first end thermally coupled to a thermal block and a second end thermally coupled to the analytic detector.

2. The process analytic device of claim 1 , wherein the process analytic device is a process gas chromatograph.

3. The process analytic device of claim 1 , wherein the thermal block is movable along the heat pipes as a cover of the process analytic device is secured.

4. The process analytic device of claim 3 , and further comprising at least one compression spring disposed to urge the thermal block against the cover.

5. The process analytic device of claim 4 , wherein one of the plurality of heat pipes is configured to slide through one of the at least one compression springs.

6. The process analytic device of claim 1 , wherein the first end of each of the heat pipes is coupled to the thermal block using a heat transfer compound.

7. The process analytic device of claim 6 , wherein the heat transfer compound comprises a thermal paste.

8. A heat pipe system for use in a process analytic device, the heat pipe system comprising:

a first heat pipe;

a second heat pipe;

a first thermal block; and

wherein each of the first and second heat pipes have a first end and a second end, wherein the first end of each of the heat pipes is configured to engage the first thermal block, and wherein the second end of each of the heat pipes engages a thermal conductivity sensor.

9. The heat pipe system of claim 8 , wherein the thermal conductivity sensor is mounted within a second thermal block.

10. The heat pipe system of claim 8 , wherein engaging the first thermal block comprises a connection between each of the heat pipes, and wherein the connection comprises a thermal paste positioned between each of the heat pipes and the first thermal block.

11. The heat pipe system of claim 8 , wherein the first thermal block further comprises a plurality of apertures, and wherein engagement between the first end of each of the heat pipes and the first thermal block comprises the first end of each of the heat pipes being received within one of the plurality of apertures within the first thermal block.

12. The heat pipe system of claim 8 , wherein the first end of each of the heat pipes is further configured to slide through a compression spring such that an end of the compression spring is in contact with the first thermal block.

13. The heat pipe system of claim 8 , wherein the plurality of heat pipes arc substantially parallel to each other.

14. The heat pipe system of claim 8 , wherein the plurality of heat pipes are perpendicular to a side of the first thermal block.

15. A system for maintaining a substantially constant temperature of a component within an analytic device, the system comprising:

a frame with a first side and a second side, wherein the first side opposes the second side;

a thermal block positioned at a first end of the frame;

the component being positioned at a second end of the frame; and

a plurality of heat pipes, each being configured to engage the thermal block at a first end thereof and to engage the component at a second end thereof.

16. The system of claim 15 , wherein each of the first and second sides further comprises a slot configured to receive a retaining pin such that the retaining pin extends at least from the first side to the second sides.

17. The system of claim 15 , wherein the thermal block is urged away from the component.