A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.
1. A probe card, comprising:
a circuit board;
a plurality of probes, wherein an end of each of the probes is connected to the circuit board;
at least one deviation-compensating member fixed to the circuit board and connected to the probes,
wherein the probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are inverse.
2. The probe card of claim 1 , wherein the first thermal expansion characteristic is thermal expansion/cool contraction, and the second thermal expansion characteristic is thermal contraction/cool expansion.
3. The probe card of claim 2 , wherein a material of the deviation-compensating member comprises bismuth (Bi), antimony (Sb), gallium (Ga), zirconium tungstate (ZrW2O8), Li2O—Al2O3-nSiO2, and bronze.
4. The probe card of claim 1 , wherein the first thermal expansion characteristic is thermal contraction/cool expansion, and the second thermal expansion characteristic is thermal expansion/cool contraction.
5. The probe card of claim 4 , wherein a material of the probes comprises bismuth, antimony, gallium, zirconium tungstate, Li2O—Al2O3-nSiO2, and bronze.
6. The probe card of claim 1 , wherein each of the probes has a needle tip, a needle body, and a needle tail sequentially connected, the needle tail is connected to the circuit board, and the deviation-compensating member is connected to the needle body.
7. The probe card of claim 1 , further comprising:
an insulating base fixed to the circuit board and connected to the deviation-compensating member; and
an adhesive member, wherein the deviation-compensating member is connected to the probes through the adhesive member.
8. The probe card of claim 7 , wherein a material of the insulating base comprises a ceramic material, and a material of the adhesive member comprises epoxy.
9. The probe card of claim 7 , wherein the adhesive member has at least one through hole communicated with the deviation-compensating member.
10. The probe card of claim 9 , further comprising a plurality of the deviation-compensating members and a plurality of the through holes, wherein the through holes divide the adhesive member into a plurality of adhesive portions, and each of the deviation-compensating members is connected to the corresponding probe through the corresponding adhesive portion.