Electroluminescent substrate, method for producing same, electroluminescent display panel, and electroluminescent display device

1. An electroluminescent substrate comprising:

a gate insulating film;

a transistor;

an electroluminescent element;

a capacitor section; and

a protective layer,

a semiconductor layer of the transistor, a lower part electrode of the electroluminescent element, and an upper part electrode of the capacitor section being provided on the gate insulating film, a source electrode of the transistor contacts and overlaps an interface between the semiconductor layer and the lower part electrode, and the protective layer being provided over the semiconductor layer, the lower part electrode, and the upper part electrode,

the protective layer having an opening through which the lower part electrode and the upper part electrode are exposed,

the semiconductor layer being an oxide semiconductor layer, and

each of the lower part electrode and the upper part electrode being a reduction electrode which has been made by reducing the oxide semiconductor layer provided on the gate insulating film.

2. The electroluminescent substrate as set forth in claim 1 , wherein:

a gate electrode of the transistor has a transparent conductive layer and a metal layer; and

the transparent conductive layer and a lower part electrode of the capacitor section are provided on a same plane and are made of a same material.

3. The electroluminescent substrate as set forth in claim 2 , wherein:

an electrode, which is made of a material identical with that of an upper part electrode of the electroluminescent element, is provided on the upper part electrode of the capacitor section via a luminescent layer.

4. The electroluminescent substrate as set forth in claim 1 , wherein:

a gate electrode of the transistor and a lower part electrode of the capacitor section are respective metal layers which are provided on a same plane and are made of a same material.

5. The electroluminescent substrate as set forth in claim 1 , wherein:

the lower part electrode of the electroluminescent element is integrated with the semiconductor layer of the transistor which is connected with the electroluminescent element.

6. The electroluminescent substrate as set forth in claim 1 , wherein:

the transistor has a top contact structure in which the source electrode and a drain electrode are provided on the semiconductor layer; and

one of the source electrode and the drain electrode of the transistor, which is connected with the electroluminescent element, is making contact with an upper surface end of the lower part electrode of the electroluminescent element.

7. An electroluminescent display panel comprising an electroluminescent substrate recited in claim 1 .

8. An electroluminescent display device comprising an electroluminescent substrate recited in claim 1 .

9. A method for producing an electroluminescent substrate, said method comprising the steps of:

(A) forming an oxide semiconductor layer on a gate insulating film;

(B) shaping the oxide semiconductor layer into a pattern that corresponds to a semiconductor layer of a transistor, a lower part electrode of an electroluminescent element, and an upper part electrode of a capacitor section, wherein a source electrode of the transistor contacts and overlaps an interface between the semiconductor layer and the lower part electrode;

(C) forming a protective film over the pattern of the oxide semiconductor layer, the protective film having an opening through which a part of the pattern, which part corresponds to the lower part electrode and the upper part electrode, is exposed; and

(D) forming the lower part electrode and the upper part electrode, which are made of a reduction electrode of the oxide semiconductor layer, by reducing the part of the pattern, which part corresponds to the lower part electrode and the upper part electrode, while using the protective film as a mask.

10. The method as set forth in claim 9 , further comprising the steps of:

(E) stacking a transparent conductive layer and a metal layer on a substrate in this order;

(F) forming (i) a gate electrode of the transistor from the transparent conductive layer and the metal layer and (ii) a lower part electrode of the capacitor section from the transparent conductive layer by (i) forming a photoresist on the metal layer, (ii) forming a photoresist pattern by carrying out half-tone exposure with respect to the photoresist, and then (iii) carrying out ashing and etching, the photoresist pattern being formed in a formation region of the gate electrode and in a formation region of the lower part electrode of the capacitor section and having a thickness which is greater in the formation region of the gate electrode than in the formation region of the lower part electrode of the capacitor section; and

(G) forming a gate insulating film on the substrate so that the gate insulating film covers the gate electrode and the lower part electrode of the capacitor section,

the steps (E), (F), and (G) being carried out before the step (A).

11. The method as set forth in claim 10 , further comprising the steps of:

(H) forming a luminescent layer on the lower part electrode of the electroluminescent element and the upper part electrode of the capacitor section; and

(I) forming (i) a first electrode pattern that faces the lower part electrode of the electroluminescent element via the luminescent layer and (ii) a second electrode pattern that faces the upper part electrode of the capacitor section via the luminescent layer by stacking a transparent conductive film on the luminescent layer and patterning the transparent conductive film, the first electrode pattern serving as an upper part electrode of the electroluminescent element.

12. The method as set forth in claim 9 , further comprising the steps of:

(J) forming a metal layer on a substrate;

(K) shaping the metal layer into a pattern that corresponds to a gate electrode of the transistor and a lower part electrode of the capacitor section; and

(L) forming a gate insulating film on the substrate so that the gate insulating film covers the gate electrode and the lower part electrode of the capacitor section,

the steps (J), (K), and (L) being carried out before the step (A).

13. The method as set forth in claim 9 , wherein:

in the step (B), a pattern corresponding to the lower part electrode of the electroluminescent element and a pattern corresponding to the semiconductor layer of the transistor, which is connected with the electroluminescent element, are formed integrally; and

said method further comprises the step of (M) forming one of the source electrode and a drain electrode of the transistor, which is connected with the electroluminescent element, such that the one of the source electrode and the drain electrode covers an end of a part of the pattern of the oxide semiconductor layer which part corresponds to the lower part electrode of the electroluminescent element, the step (M) being carried out before the step (C).

14. The method as set forth in claim 9 , further comprising the step of: (N) forming a pattern of the source electrode and a drain electrode on a part of the pattern of the oxide semiconductor layer, which part corresponds to the semiconductor layer of the transistor, such that one of the source electrode and the drain electrode makes contact with an upper surface end of a part of the pattern of the oxide semiconductor layer which part corresponds to the lower part electrode of the electroluminescent element, the step (N) being carried out before the step (C).