Buffer die in stacks of memory dies and methods
Memory devices and methods of making and operating them are shown. Memory devices shown include stacked memory dies with one or more buffer dies included. In one such memory device, a command die communicates with one or more downstream memory dies through the one or more buffer dies. The one or more buffer dies function to repeat signals, and can potentially improve performance for higher numbers of memory dies in the stack.
1. A device, comprising:
a stack of memory dies;
a command die coupled to communicate with the stack of memory dies; and
a plurality of buffer dies stacked within the stack of memory dies, wherein the plurality of buffer dies are each configured to communicate with the command die, and repeat a signal between the command die and a downstream memory die in the stack of memory dies, and wherein a first buffer die is configured to communicate with a second buffer die, wherein both the first and second buffer dies are within the stack of memory dies, and the first and second buffer dies are separated from one another by one or more intermediate memory dies.
2. The device of claim 1 , wherein at least one of the plurality of buffer dies is also configured to function as a memory die.
3. The device of claim 1 , wherein the command die is also configured to function as a memory die.
4. The device of claim 1 , wherein a first buffer die is configured to communicate with downstream memory devices using a through silicon via.
5. The device of claim 4 , wherein the first buffer die is configured to communicate with the command die using a bypass through silicon via.
6. The device of claim 1 , wherein at least one of the plurality of buffer dies is configured to communicate with a memory die above the at least one buffer die, and is also configured to communicate with a memory die below the at least one buffer die.
7. The device of claim 1 , wherein the command die is stacked with the stack of memory dies.
8. The device of claim 1 , wherein a communication path between dies in the stack of memory dies comprises a bi-directional communication path.
9. The device of claim 1 , wherein a communication path between dies in the stack of memory dies comprises a unidirectional communication path.
10. A memory device, comprising:
a stack of memory dies;
a command die to communicate with the stack of memory dies;
a plurality of buffer dies stacked within the stack of memory dies, wherein the plurality of buffer dies are each configured to communicate with the command die, and repeat a signal between the command die and a downstream memory die in the stack of memory dies, and wherein a first buffer die is configured to communicate with a second buffer die, wherein both the first and second buffer dies are within the stack of memory dies, and the first and second buffer dies are separated from one another by one or more intermediate memory dies; and
a power regulation circuit in at least one buffer die.
11. The memory device of claim 10 , wherein the power regulation circuit comprises a voltage boosting circuit.
12. The memory device of claim 10 , wherein the power regulation circuit comprises a noise reduction circuit.
13. The device of claim 10 , wherein the command die is stacked with the stack of memory dies.
14. The device of claim 10 , wherein a communication path between dies in the stack of memory dies comprises a bi-directional communication path.
15. The device of claim 10 , wherein a communication path between dies in the stack of memory dies comprises a unidirectional communication path.
16. The device of claim 10 , wherein at least one of the plurality of buffer dies is configured to communicate with a memory die above the at least one buffer die, and is also configured to communicate with a memory die below the at least one buffer die.
17. A device, comprising:
a stack of memory dies;
a command die coupled to communicate with the stack of memory dies;
a plurality of buffer dies stacked within the stack of memory dies, including a first buffer die, and a second buffer die between the first buffer die and the command die;
wherein the plurality of buffer dies are each configured to communicate with the command die, and repeat a signal between the command die and a downstream memory die in the stack of memory dies;
a bypass through silicon via coupled directly between the command die and the first buffer die; and
a power regulation circuit in at least one buffer die that includes functionality to put one or more dies in the stack of memory dies into a low power mode.
18. The device of claim 17 , wherein the second buffer die is configured to communicate with a memory die above the second buffer die, and is also configured to communicate with a memory die below the second buffer die.
19. The device of claim 18 , wherein the first buffer die is configured to communicate with a memory die above the first buffer die, and is also configured to communicate with a memory die below the first buffer die.