Semiconductor device and method for manufacturing semiconductor device

1. A semiconductor device comprising:

a first interlayer film having a first region and a second region;

a MIM structure including a lower electrode formed on the second region, a first capacitance film formed on the lower electrode, and an upper electrode formed on the first capacitance film;

a lower metal layer formed on the first region, the lower metal layer disposed in the same layer level with the lower electrode;

an auxiliary metal layer disposed in the same layer level with the upper electrode, the auxiliary metal layer being opposed to the lower metal layer;

a second interlayer film formed on the first interlayer film, covering the auxiliary metal layer and the MIM structure;

a top metal layer formed on the second interlayer film, and penetrating through the second interlayer film to contact the auxiliary metal layer, the top metal layer having a lead-out portion led out to an outside of the auxiliary metal layer in a plan view;

a second capacitance film sandwiched between the auxiliary metal layer and the lower metal layer, the second capacitance film disposed in the same layer level with the first capacitance film; and

a plurality of vias that penetrate through the second interlayer film,

wherein the lower metal layer, the second capacitance film and the auxiliary metal layer define a second MIM structure disposed beneath the top metal layer,

wherein in the plan view, the lower metal layer has an annular shaped contact region led out to an outside of the auxiliary metal layer and surrounding an entire peripheral edge of the auxiliary metal layer throughout the entire peripheral edge of the auxiliary metal layer,

wherein the plurality of vias connects the lead-out portion and the contact region to each other, and

the vias are arrayed at intervals throughout an entire peripheral edge of the lower metal layer.

2. The semiconductor device according to claim 1 , wherein an opening is formed between portions of the second interlayer film, to expose the auxiliary metal layer, wherein

the top metal layer enters the opening to be in contact with the auxiliary metal layer.

3. The semiconductor device according to claim 2 , wherein the top metal layer has a recess portion formed at a position over the opening.

4. The semiconductor device according to claim 2 , wherein the opening is tapered off toward the auxiliary metal layer.

5. The semiconductor device according to claim 1 , wherein the plurality of vias is made of tungsten, and

the top metal layer is made of a material different from tungsten.

6. A method for manufacturing a semiconductor device comprising:

a step of forming a first interlayer film having a first region and a second region;

a step of forming a lower electrode on the second region, and forming a lower metal layer on the first region using a material for the lower electrode;

a step of forming a first capacitance film on the lower electrode;

a step of forming an upper electrode on the first capacitance film, and forming an auxiliary metal layer at a position opposed to the lower metal layer using a material for the upper electrode;

a step of forming a second interlayer film on the first interlayer film so as to cover the upper electrode and the auxiliary metal layer;

a step of forming a top metal layer that penetrates through the second interlayer film and contacts the auxiliary metal layer, the top metal layer having a lead-out portion led out to an outside of the auxiliary metal layer in a plan view;

a step of forming a second capacitance film sandwiched between the auxiliary metal layer and the lower metal layer, the second capacitance film disposed in the same layer level with the first capacitance film; and

forming a plurality of vias that penetrate through the second interlayer film,

wherein the lower metal layer, the second capacitance film and the auxiliary metal layer define a second MIM structure disposed beneath the top metal layer,

wherein in the plan view, the lower metal layer has an annular shaped contact region led out to an outside of the auxiliary metal layer and surrounding an entire peripheral edge of the auxiliary metal layer throughout the entire peripheral edge of the auxiliary metal layer,

wherein the plurality of vias connects the lead-out portion and the contact region to each other, and

the vias are arrayed at intervals throughout an entire peripheral edge of the lower metal layer.

7. The method for manufacturing a semiconductor device according to claim 6 , wherein when forming the first capacitance film, also forming the second capacitance film on the lower metal layer using a material for the first capacitance film.

8. The method for manufacturing a semiconductor device according to claim 7 , further comprising a step of, after forming the lower electrode and the lower metal layer, forming the upper electrode, the auxiliary metal layer, the first capacitance film, and the second capacitance film by successively laminating the material for the first capacitance film and the material for the upper electrode, and successively etching the materials with an identical pattern.

9. The method for manufacturing a semiconductor device according to claim 7 , wherein in the step of forming the auxiliary metal layer, the auxiliary metal layer is disposed to be directly above the lower metal layer.

10. The semiconductor device according to claim 1 , wherein the auxiliary metal layer is disposed to be directly above the lower metal layer.