Manufacturing method of semiconductor structure
A manufacturing method of a semiconductor structure provides a substrate. A well having a first conductive type and a well having a second conductive type are formed in the substrate, respectively. A body region is formed in the well having the second conductive type. A first doped region and a second doped region are formed in the well having the first conductive type and the body region respectively. The first and second doped regions have same polarities, and a dopant concentration of the second doped region is higher than that of the first doped region. A third doped region is formed in the well having the second conductive type and between the first and second doped regions. The third and first doped regions have reverse polarities. A first field plate is formed on a surface region between the second and third doped regions.
1. A manufacturing method of a semiconductor structure, the method comprising:
providing a substrate;
forming a well having a first conductive type and a well having a second conductive type in the substrate respectively;
forming a body region in the well having the second conductive type;
forming a first doped region and a second doped region in the well having the first conductive type and the body region respectively, wherein the second doped region and the first doped region has same polarities, and a dopant concentration of the second doped region is higher than a dopant concentration of the first doped region;
forming a third doped region in the well having the second conductive type and between the first doped region and the second doped region, the third doped region and the first doped region have reverse polarities; and
forming a first field plate on a surface region of the well having the second conductive type between the second doped region and the third doped region, and the first field plate laterally crossovers a portion of surface region of the body region and the surface region of the well having the second conductive type, and the body region is an emitter region having the first conductive type different from the second conductive type.
2. The method according to claim 1 , further comprising forming a second field plate on a surface region between the first doped region and the third doped region.
3. The method according to claim 2 , wherein the second field plate laterally crossovers a surface region of the well having the first conductive type and a surface region of the well having the second conductive type.
4. The method according to claim 2 , wherein the second field plate is made of poly silicon.
5. The method according to claim 2 , wherein before forming the second field plate, further comprising forming a field oxide on the surface region between the first doped region and the third doped region, and after forming the second field plate, the second field plate covers the field oxide.
6. The method according to claim 1 , wherein before forming the first field plate, further comprising forming a field oxide on the surface region between the second doped region and the third doped region, and after forming the first field plate, the first field plate covers the field oxide.
7. The method according to claim 1 , wherein the first field plate is made of poly silicon.
8. A manufacturing method of a semiconductor structure, the method comprising:
providing a substrate;
forming a well having a first conductive type and a well having a second conductive type in the substrate respectively;
forming a body region in the well having the second conductive type;
forming a first doped region and a second doped region in the well having the first conductive type and the body region respectively, wherein the second doped region and the first doped region has same polarities, and a dopant concentration of the second doped region is higher than a dopant concentration of the first doped region;
forming a third doped region in the well having the second conductive type and between the first doped region and the second doped region, the third doped region and the first doped region have reverse polarities;
forming a first field plate on a surface region of the well having the second conductive type between the second doped region and the third doped region, and a forward bias between the second doped region and the third doped region is controlled by the first field plate; wherein the first field plate laterally crossovers a portion of surface region of the body region and the surface region of the well having the second conductive type, and the body region is an emitter region having the first conductive type different from the second conductive type; and
forming a second field plate on a surface region between the first doped region and the third doped region, and a reverse bias between the first doped region and the third doped region is controlled by the second field plate.
9. The method according to claim 8 , wherein the second field plate laterally crossovers a surface region of the well having the first conductive type and a surface region of the well having the second conductive type.
10. The method according to claim 8 , wherein the second field plate is made of poly silicon.
11. The method according to claim 8 , wherein before forming the second field plate, further comprising forming a field oxide on the surface region between the first doped region and the third doped region, and after forming the second field plate, the second field plate covers the field oxide.
12. The method according to claim 8 , wherein before forming the first field plate, further comprising forming a field oxide on the surface region between the second doped region and the third doped region, and after forming the first field plate, the first field plate covers the field oxide.
13. The method according to claim 8 , wherein the first field plate is made of poly silicon.
14. The method according to claim 8 , wherein the first doped region is a collector region having the first conductive type.