Light-emitting diode (LED) package

1. A light-emitting diode (LED) package comprising:

a light-emitting structure comprising a first conductive-type semiconductor layer, an active layer provided on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer provided on the active layer;

an isolating insulation layer provided on two side portions of the light-emitting structure and an upper portion of the light-emitting structure, the upper portion connecting the two side portions;

a first connection electrode portion electrically connected to the first conductive-type semiconductor layer;

a second connection electrode portion electrically connected to the second conductive-type semiconductor layer;

a first electrode pad electrically connected to the first connection electrode portion;

a second electrode pad electrically connected to the second connection electrode portion;

a first molding resin layer provided between the first electrode pad and the second electrode pad;

a first pillar electrode electrically connected to the first electrode pad;

a second pillar electrode electrically connected to the second electrode pad; and

a second molding resin layer provided on the first molding resin layer, the first electrode pad, and the second electrode pad, and between the first pillar electrode and the second pillar electrode.

2. The LED package of claim 1 , wherein the first molding resin layer comprises a material layer which has a reflectivity that is higher than a reflectivity of the second molding resin layer, and the second molding resin layer comprises a material layer which has a reliability that is higher than a reliability of the first molding resin layer.

3. The LED package of claim 1 , wherein the first molding resin layer is an encapsulation layer sealing a gap between the first electrode pad and the second electrode pad.

4. The LED package of claim 3 , further comprising a first reflective layer provided on the first molding resin layer.

5. The LED package of claim 4 , further comprising a second reflective layer provided between the first molding resin layer and the second molding resin layer.

6. The LED package of claim 1 , wherein the first molding resin layer contacts a surface and a side wall of the first electrode pad, a surface and a sidewall of the second electrode pad, a side wall of the first pillar electrode, and a sidewall of the second pillar electrode, and

the second molding resin layer contacts the first molding resin layer.

7. The LED package of claim 1 , wherein the second molding resin layer is an encapsulation layer sealing a gap between the first pillar electrode and the second pillar electrode.

8. The LED package of claim 1 , wherein the light-emitting structure is a mesa-type light-emitting structure,

the isolating insulation layer insulates the mesa-type light-emitting structure,

the first connection electrode portion comprises a pole electrode layer penetrating the isolating insulation layer, and

the light-emitting structure further comprises a first contact layer provided on the first conductive-type semiconductor layer under the pole electrode layer.

9. The LED package of claim 1 , wherein the light-emitting structure is a mesa-type light-emitting structure,

the isolating insulation layer insulates the mesa-type light-emitting structure,

the second connection electrode portion comprises a plate electrode layer, and the plate electrode layer is provided in the isolating insulation layer, and

the light-emitting structure further comprises a second contact layer provided on the second conductive-type semiconductor layer under the plate electrode layer.

10. The LED package of claim 1 , wherein the first electrode pad and the second electrode pad are provided on the isolating insulation layer on the upper portion and the two side portions of the light-emitting structure.

11. A light-emitting diode (LED) package comprising:

a first pad area comprising:

a first portion of a light-emitting structure comprising a first conductive-type semiconductor layer, an active layer, and a second conductive-type semiconductor layer, and

a first electrode pad electrically connected to the first conductive-type semiconductor layer;

a second pad area comprising:

a second portion of the light-emitting structure, and

a second electrode pad electrically connected to the second conductive-type semiconductor layer;

a pad isolating area which comprises a first molding resin layer and electrically isolates the first pad area and the second pad area from each other;

a first pillar electrode provided on the first electrode pad in the first pad area and a second pillar electrode provided on the second electrode pad in the second pad area; and

a second molding resin layer provided between the first pillar electrode in the first pad area and the second pillar electrode in the second pad area, and on the pad isolating area,

wherein the first molding resin layer has a reflectivity that is higher than a reflectivity of the second molding resin layer.

12. The LED package of claim 11 , wherein the second molding resin layer comprises a material layer which has a reliability that is higher than a reliability of the first molding resin layer.

13. The LED package of claim 11 , further comprising a first reflective layer provided on the first molding resin layer in the pad isolating area.

14. The LED package of claim 11 , wherein the first molding resin layer contacts a surface of the first electrode pad, a surface of the second electrode pad, a side wall of the first pillar electrode, and a side wall of the second pillar electrode, and

the second molding resin layer contacts the first molding resin layer in the pad isolating area.

15. The LED package of claim 11 , further comprising a second reflective layer provided between the first molding resin layer and the second molding resin layer in the first pad area, the second pad area, and the pad isolating area.

16. An illumination apparatus comprising:

a first electrode pad;

a first electrode provided on the first electrode pad;

a second electrode pad;

a second electrode provided on the second pad;

a first molding resin layer provided between the first electrode pad and the second electrode pad;

a second molding resin layer provided between the first electrode and the second electrode; and

a reflective layer provided between the first molding resin layer and the second molding resin layer,

wherein the first molding resin layer has a reflectivity that is higher than a reflectivity of the second molding resin layer.

17. The illumination apparatus of claim 16 , wherein the reflective layer comprises a distributed Bragg reflector.

18. The illumination apparatus of claim 16 , wherein the first molding resin layer comprises a portion having a concave shape and the second molding resin layer is provided inside of the concave shape.

19. The LED package of claim 16 , wherein:

the second molding resin layer comprises a material layer which has a reliability that is higher than a reliability of the first molding resin layer, and

the reliability of the second molding resin layer comprises reliability in terms of at least one of wetting, tolerance, or strength.