IP Library › Granted Patent US 9,696,751
Granted Patent B2
US 9,696,751 · App. 14/401,495 · Granted Jul 4, 2017

Substrate with transparent electrode, method for manufacturing same, and touch panel

Inventors: Hiroaki Ueda (Otsu, JP); Kozo Kondo (Otsu, JP); Kazuhisa Danno (Otsu, JP)
Assignee: KANEKA CORPORATION
G06F1/16C23C14/0036C23C14/08C23C14/083C23C14/086C23C14/10C23C14/34C23C14/35C23C14/562G06F3/044G06F2203/04103G06F2203/04112
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Quick Facts
Patent No.
US 9,696,751
App. No.
14/401,495
Granted
Jul 4, 2017
Kind
B2
Abstract

A substrate is provided with a transparent electrode in which the pattern is hardly visible even when the transparent electrode layer has been patterned, and a method for manufacturing thereof is provided. On at least one of the surfaces of a transparent film, a first, second, and third dielectric material layer, and a patterned transparent electrode layer are included, in this order, each preferably having a film thickness and refractive index within a specific range. The first and third dielectric material layers are silicon oxide layers containing SiO x and SiO v as main components, respectively. The second dielectric material layer is a metal oxide layer containing a metal oxide. The transparent electrode layer is a conductive metal oxide layer containing an indium-tin composite oxide as a main component. The refractive indexes of the first (n 1 ), second (n 2 ), and third (n 3 ) dielectric material layers satisfy the relationship n3<n1<n2.

Claims (19)

1. A substrate with a transparent electrode, comprising: a transparent film; and a first dielectric material layer, a second dielectric material layer, a third dielectric material layer, and a transparent electrode layer patterned into an electrode layer-formed part and an electrode layer-non-formed part, in this order on at least one surface of the transparent film, wherein

the first dielectric material layer is a silicon oxide layer containing SiO x (x ≧1.5) as a main component and having a thickness of 1 nm to 25 nm,

the second dielectric material layer is a metal oxide layer containing as a main component at least one oxide of a metal selected from the group consisting of Nb, Ta, Ti, Zr, Zn and Hf and having a thickness of 5 nm or more and less than 10 nm,

the third dielectric material layer is a silicon oxide layer containing SiO y (y >x) as a main component and having a thickness of 35 nm to 80 nm,

the transparent electrode layer is a conductive metal oxide layer containing an indium-tin composite oxide as a main component and having a thickness of 20 nm to 35nm, and the indium-tin composite oxide has an average crystal grain size of 200 nm to 700 nm and a crystal grain size variation coefficient of 0.35 or more,

a refractive index n 1 of the first dielectric material layer, a refractive index n 2 of the second dielectric material layer and a refractive index n 3 of the third dielectric material layer satisfy a relationship of n 3 <n 1 <n 2 ,

the transparent electrode layer has a resistivity of 5.0×10 −4 Ω·cm or less, and

the electrode layer-formed part of the substrate with transparent electrode has a transmittance of 87% or more.

2. The substrate with a transparent electrode according to claim 1 , wherein the transparent electrode layer has a refractive index n 4 of 1.88 or less.

3. The substrate with a transparent electrode according to claim 1 , wherein a refractive index n 4 of the transparent electrode layer is larger than the refractive index n 1 of the first dielectric material layer, and smaller than the refractive index n 2 of the second dielectric material layer.

4. The substrate with a transparent electrode according to claim 1 , wherein the transparent electrode layer has a resistivity of 3.7×10 −4 Ω·cm or less.

5. The substrate with a transparent electrode according to claim 1 , wherein an arithmetic mean roughness of the third dielectric material layer is 1 nm or less.

6. The substrate with a transparent electrode according to claim 1 , wherein the second dielectric material layer is a metal oxide layer containing Nb 2 O 5 as a main component.

7. The substrate with a transparent electrode according to claim 1 , wherein the transparent electrode layer has a carrier density of 6.1×10 20 /cm 3 or more.

8. The substrate with a transparent electrode according to claim 1 , wherein the transparent electrode layer contains tin oxide in an amount of 4 parts by weight to 14 parts by weight based on 100 parts by weight of a sum of indium oxide and tin oxide.

9. The substrate with a transparent electrode according to claim 1 , wherein the thickness of the third dielectric material layer is more than 55 nm and not more than 80 nm.

10. A substrate with a transparent electrode, comprising: a transparent film; and a dielectric material layer containing an oxide as a main component and a transparent electrode layer patterned into an electrode layer-formed part and an electrode layer-non-formed part, in this order, on at least one surface of the transparent film, wherein

the transparent electrode layer is a conductive metal oxide layer containing an indium-tin composite oxide as a main component and having a thickness of 20 nm to 35 nm, and a resistivity of the transparent electrode layer is 5.0×10 −4 Ω·cm or less, and

an indium-tin composite oxide in the transparent electrode layer has an average crystal grain size of 200 nm to 700 nm and a crystal grain size variation coefficient of 0.35 or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 14, 2014
From: UEDA, HIROAKI; KONDO, KOZO; DANNO, KAZUHISA
To: KANEKA CORPORATION
Reel/Frame 034179/0229 →
Priority Claims (1)
JP 2012-113242 · May 17, 2012 · national
Continuity (1)
Related Publication 20150145816A1 · May 28, 2015