Controlled spalling utilizing vaporizable release layers

1. A method, comprising:

providing a base substrate;

depositing a stressor layer and a vaporizable release layer on the base substrate;

forming a flexible support layer on at least one of the stressor layer and the vaporizable release layer;

spalling an upper portion of the base substrate;

securing the spalled upper portion of the base substrate to a handle substrate; and

vaporizing the vaporizable release layer to release at least the flexible support layer from a remaining structure comprising the spalled upper portion of the base substrate secured to the handle substrate;

wherein vaporizing the vaporizable release layer comprises applying heat to the vaporizable release layer to substantially or completely vaporize the vaporizable release layer such that the flexible support layer is physically released from said remaining structure as a direct result of the substantial or complete vaporization of the vaporizable release layer.

2. The method of claim 1 , wherein the vaporizable release layer is positioned between the stressor layer and the flexible support layer.

3. The method of claim 1 , wherein the vaporizable release layer is positioned between the stressor layer and the base substrate.

4. The method of claim 1 , further comprising:

forming a patterned vaporizable release layer on the base substrate, which comprises an opening that exposes a portion of the base substrate;

forming the stressor layer on the patterned vaporizable release layer and in contact with the onion of the base substrate exposed through the opening of the patterned vaporizable release layer; and

applying heat to the patterned vaporizable release layer to debond portions of the stressor layer which overlap the patterned vaporizable release layer to thereby define edges of the stressor layer.

5. The method of claim 1 , wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive.

6. The method of claim 1 , wherein the vaporizable release layer is applied via a standard spin coat process.

7. The method of claim 1 , wherein said remaining structure comprises the stressor layer and wherein the method further comprises removing the stressor layer from the spalled upper portion of the base substrate secured to the handle substrate, following the vaporizing of the vaporizable release layer.

8. An apparatus, comprising:

a handle substrate;

a spalled upper portion of a base substrate, wherein the spalled upper portion of the base substrate is bonded to the handle substrate;

a stressor layer and a vaporizable release layer forming a stacked structure that is coupled to the spalled upper portion of the base substrate;

a flexible support layer formed on at least one of the stressor layer and the vaporizable release layer;

wherein the vaporizable release layer is configured to release at least the flexible support layer from a remaining structure comprising the spalled upper portion of the base substrate secured to the handle substrate upon the application of heat to the vaporizable release layer to substantially or completely vaporize the vaporizable release layer such that the flexible support layer is physically released from said remaining structure as a direct result of the substantial or complete vaporization of the vaporizable release layer.

9. The apparatus of claim 8 , wherein the vaporizable release layer is positioned between the stressor layer and the flexible support layer.

10. The apparatus of claim 8 , wherein the vaporizable release layer is positioned between the stressor layer and the spalled upper portion of the base substrate.

11. The apparatus of claim 8 , wherein the stacked structure comprises a patterned vaporizable release layer that is disposed on the spalled upper portion of the base substrate, wherein the patterned vaporizable release layer is patterned to define edges of the stressor layer.

12. The apparatus of claim 8 , wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive.

13. The apparatus of claim 12 , wherein the vaporizable release layer is pre-coated onto the flexible support layer.

14. The apparatus of claim 8 , wherein the vaporizable release layer is applied via a standard spin coat process.

15. A method for spalling a base substrate, comprising:

providing the base substrate;

depositing a vaporizable release layer on the base substrate;

depositing a stressor layer on the vaporizable release layer;

forming a flexible support layer on the stressor layer;

spalling an upper portion of the base substrate;

securing the spalled upper portion of the base substrate to a handle substrate; and

vaporizing the vaporizable release layer to release the flexible support layer and the stressor layer from the spalled upper portion of the base substrate secured to the handle substrate;

wherein vaporizing the vaporizable release layer comprises applying heat to the vaporizable release layer to substantially or completely vaporize the vaporizable release layer such that the flexible support layer and stressor layer are physically released from the spalled upper portion of the base substrate as a direct result of the substantial or complete vaporization of the vaporizable release layer.

16. The method of claim 15 , wherein the flexible support layer comprises at least one of a flexible support tape and a tape adhesive.

17. The method of claim 15 , wherein the vaporizable release layer is applied via a standard spin coat process.