Heated substrate support with temperature profile control

1. A substrate support, comprising:

a plate having a substrate receiving surface and an opposite bottom surface; and

a shaft comprising an elongated structure having a first end coupled to the bottom surface of the plate and a second end, wherein a shaft heater is embedded in the first end of the shaft.

2. The substrate support of claim 1 , wherein the first end comprises a flange and the shaft heater is disposed within the flange.

3. The substrate support of claim 1 , wherein the shaft heater is a resistive heater.

4. The substrate support of claim 3 , wherein the shaft heater comprises a conductor embedded in the shaft.

5. The substrate support of claim 4 , wherein the conductor is coupled to a power supply to the shaft heater.

6. The substrate support of claim 1 , further comprising:

a power supply coupled to the shaft heater and coupled to a controller; and

a shaft temperature sensor disposed at the first end and coupled to the controller, wherein the shaft heater, the power supply, the controller, and the shaft temperature sensor are linked in a first closed loop control circuit.

7. The substrate support of claim 6 , wherein the plate further comprises:

a plate heater disposed in the plate;

a power supply coupled to the plate heater and coupled to the controller; and

a plate temperature sensor disposed in the plate and coupled to the controller,

wherein the plate heater, the power supply, the controller, and the plate temperature sensor are linked in a second closed loop control circuit.

8. The substrate support of claim 7 , wherein the controller is configured to independently control the first closed loop control circuit and the second closed loop control circuit to maintain the plate and the shaft at a preselected temperature.

9. The substrate support of claim 1 , wherein the shaft is formed from a layer of ceramic material.

10. The substrate support of claim 9 , wherein the ceramic material comprises one or more of silicon nitride (Si 3 N 4 ), alumina (Al 2 O 3 ), aluminum nitride (AlN), or silicon carbide (SiC).

11. The substrate support of claim 9 , wherein the shaft is formed from two or more layers of ceramic material.

12. The substrate support of claim 9 , wherein the shaft heater is disposed on a layer of ceramic material.

13. The substrate support of claim 9 , wherein the shaft further comprises a conductor disposed on the layer of ceramic material and coupled to the shaft heater.

14. A substrate support, comprising:

a plate having a substrate receiving surface and an opposite bottom surface;

a plate heater disposed in the plate;

a plate temperature sensor disposed in the plate, wherein the plate heater and the plate temperature sensor are coupled to a controller;

a shaft comprising an elongated structure having a first end coupled to the bottom surface of the plate and a second end, wherein a shaft heater is embedded in the first end of the shaft; and

a shaft temperature sensor disposed at the first end wherein the shaft temperature sensor and the shaft heater are coupled to a controller.

15. A method of making a substrate support, comprising:

forming a plate having a substrate receiving surface and an opposite bottom surface;

forming a first layer of ceramic material, the first layer comprising a first end and an opposite second end;

embedding a heater on the first layer at the first end;

disposing a conduit on the first layer such that one end of the conduit is coupled to the heater and a second end of the conduit extends beyond the second end of the ceramic material;

forming a second layer of ceramic material atop the first layer such the second layer at least partially covers the heater;

processing the first layer and the second layer to form a shaft; and

coupling the first end to the bottom surface of the plate.

16. The method of claim 15 , wherein the heater is printed on the first layer of ceramic material.

17. The method of claim 15 , further comprising embedding a plate heater in the plate.

18. The method of claim 15 , wherein the second layer at least partially covers the conduit.

19. The method of claim 15 , wherein the plate is formed from a ceramic material.