Semiconductor device and method for manufacturing the same
An object is to provide a thin film transistor using an oxide semiconductor layer, in which contact resistance between the oxide semiconductor layer and source and drain electrode layers is reduced and electric characteristics are stabilized. The thin film transistor is formed in such a manner that a buffer layer including a high-resistance region and low-resistance regions is formed over an oxide semiconductor layer, and the oxide semiconductor layer and source and drain electrode layers are in contact with each other with the low-resistance region of the buffer layer interposed therebetween.
1. A method for manufacturing a semiconductor device, comprising the steps of:
forming a gate electrode layer over a substrate;
forming a gate insulating layer over the gate electrode layer;
forming a first oxide semiconductor film over the gate insulating layer by a sputtering method;
performing heat treatment on the first oxide semiconductor film in an atmospheric atmosphere;
forming a second oxide semiconductor film over the first oxide semiconductor film by a sputtering method;
performing heat treatment on the second oxide semiconductor film in a nitrogen atmosphere;
forming an oxide semiconductor layer and a buffer layer by etching the first oxide semiconductor film and the second oxide semiconductor film;
forming a conductive film over the oxide semiconductor layer and the buffer layer;
forming source and drain electrode layers by etching the conductive film; and
performing heat treatment on the buffer layer in an atmospheric atmosphere so as to form a first region and a second region in the buffer layer,
wherein the first region overlaps the source and drain electrode layers,
wherein the second region does not overlap the source and drain electrode layers,
wherein conductivity of the first region is higher than conductivity of the oxide semiconductor layer, and
wherein conductivity of the second region is lower than conductivity of the first region.
2. The method for manufacturing a semiconductor device, according to claim 1 , wherein the second oxide semiconductor film is formed in an atmosphere of a rare gas and a nitrogen gas.
3. The method for manufacturing a semiconductor device, according to claim 1 , further comprising the step of performing reverse sputtering treatment on the second oxide semiconductor film before performing heat treatment in the nitrogen atmosphere.
4. The method for manufacturing a semiconductor device, according to claim 1 , wherein an edge portion of the first region is covered with the source or drain electrode layer.
5. The method for manufacturing a semiconductor device, according to claim 1 , wherein the first oxide semiconductor layer comprises indium, gallium, and zinc.
6. The method for manufacturing a semiconductor device, according to claim 1 , wherein the first oxide semiconductor layer comprises indium, tin, and zinc.
7. The method for manufacturing a semiconductor device, according to claim 1 , wherein the first oxide semiconductor layer comprises gallium, tin, and zinc.
8. The method for manufacturing a semiconductor device, according to claim 1 , wherein the first oxide semiconductor layer comprises a nanocrystal.