Semiconductor device, electronic component, and electronic device
To provide a semiconductor device including a small-area circuit with high withstand voltage, an oxide semiconductor (OS) transistor is used as some of transistors included in a circuit handling an analog signal in a circuit to which high voltage is applied. The use of an OS transistor with high withstand voltage as a transistor requiring resistance to high voltage enables the circuit area to be reduced without lowering the performance, as compared to the case using a Si transistor. Furthermore, an OS transistor can be provided over a Si transistor, so that transistors using different semiconductor layers can be stacked, resulting in a much smaller circuit area.
1. A semiconductor device comprising:
a first circuit, a second circuit, and a third circuit,
wherein:
the first circuit receives a first signal and is configured to boost a first voltage of the first signal into a second voltage,
the second circuit is configured to convert the first signal into a second signal,
the third circuit receives the second signal and is configured to amplify a first amount of current of the second signal to a second amount of current and is configured to output the second amount of current,
the second circuit comprises first to fourth wirings and first to third transistors,
wherein one of a source and a drain of the first transistor is electrically connected to the first wiring,
wherein one of a source and a drain of the second transistor is electrically connected to the second wiring,
wherein one of a source and a drain of the third transistor is electrically connected to the third wiring,
wherein the other of the source and the drain of the first transistor, the other of the source and the drain of the second transistor, and the other of the source and the drain of the third transistor is directly connected to the fourth wiring,
wherein gates of the first to third transistor is electrically connected to the first circuit,
wherein the fourth wiring is electrically connected to the third circuit,
the first to third wirings are configured to transmit different voltages,
the first to third transistors are configured to operate as switches, and
each of the first to third transistors comprises a semiconductor layer comprising an oxide semiconductor.
2. The semiconductor device according to claim 1 , wherein:
the first circuit comprises a fourth transistor and a fifth transistor,
the fourth transistor is electrically connected to a wiring applying the first voltage,
the fifth transistor is electrically connected to a wiring applying the second voltage,
the fourth transistor comprises a semiconductor layer comprising silicon, and
the fifth transistor comprises a semiconductor layer comprising an oxide semiconductor.
3. An electronic component comprising:
the semiconductor device according to claim 1 ; and
a bump terminal electrically connected to the semiconductor device.
4. An electronic device comprising:
the electronic component according to claim 3 ; and
a display device.
5. A semiconductor device comprising:
a first circuit, a second circuit, and a third circuit,
wherein:
the first circuit receives a first signal and is configured to boost a first voltage of the first signal into a second voltage,
the second circuit is configured to convert the first signal into a second signal,
the third circuit receives the second signal and is configured to amplify a first amount of current of the second signal to a second amount of current and is configured to output the second amount of current,
the second circuit comprises a plurality of wirings, a first transistor, and a second transistor,
wherein one of a source and a drain of the first transistor is electrically connected to the first wiring,
wherein one of a source and a drain of the second transistor is electrically connected to the second wiring,
wherein one of a source and a drain of the third transistor is electrically connected to the third wiring,
wherein the other of the source and the drain of the first transistor, the other of the source and the drain of the second transistor, and the other of the source and the drain of the third transistor is directly connected to the fourth wiring,
wherein gates of the first to third transistor is electrically connected to the first circuit,
wherein the fourth wiring is electrically connected to the third circuit,
the plurality of wirings comprise a first wiring configured to transmit the first voltage, and a second wiring configured to transmit the second voltage higher than the first voltage,
the first to third transistors are configured to operate as switches,
the first transistor comprises a semiconductor layer comprising an oxide semiconductor, and
the second transistor comprises a semiconductor layer comprising silicon.
6. The semiconductor device according to claim 5 , wherein:
the first circuit comprises a third transistor and a fourth transistor,
the third transistor is electrically connected to a wiring applying the first voltage,
the fourth transistor is electrically connected to a wiring applying the second voltage,
the third transistor comprises a semiconductor layer comprising silicon, and
the fourth transistor comprises a semiconductor layer comprising an oxide semiconductor.
7. An electronic component comprising:
the semiconductor device according to claim 5 ; and
a bump terminal electrically connected to the semiconductor device.
8. An electronic device comprising:
the electronic component according to claim 7 ; and
a display device.
9. The semiconductor device according to claim 5 ,
wherein the first transistor is positioned over an insulating film,
wherein the insulating film is positioned over the second transistor, and
wherein a channel region of the first transistor and a channel region of the second transistor overlap with each other.