Manufacturing method of semiconductor device with silicon layer containing carbon
A semiconductor device having an n channel MISFET formed on an SOI substrate including a support substrate, an insulating layer formed on the support substrate and a silicon layer formed on the insulating layer has the following structure. An impurity region for threshold adjustment is provided in the support substrate of a gate electrode so that the silicon layer contains carbon. The threshold value can be adjusted by the semiconductor region for threshold adjustment in this manner. Further, by providing the silicon layer containing carbon, even when the impurity of the semiconductor region for threshold adjustment is diffused to the silicon layer across the insulating layer, the impurity is inactivated by the carbon implanted into the silicon layer. As a result, the fluctuation of the transistor characteristics, for example, the fluctuation of the threshold voltage of the MISFET can be reduced.
1. A manufacturing method of a semiconductor device comprising the steps of:
(a) preparing a substrate having a semiconductor substrate, an insulating layer formed on the semiconductor substrate, and a semiconductor layer formed on the insulating layer;
(b) forming a semiconductor region by ion-implanting an n type impurity or a p type impurity into the semiconductor substrate such that an impurity concentration profile of the p type or n type impurity extends from the semiconductor region through the insulating layer and into the semiconductor layer, the impurity concentration profile having a maximum in the semiconductor region, the semiconductor region being below the insulating layer;
(c) ion-implanting carbon into the semiconductor layer such that the p type or n type impurity in the semiconductor layer is inactivated by the carbon in the semiconductor layer; and
(d) after the steps (b) and (c), forming a field effect transistor on a main surface of the semiconductor layer.
2. The manufacturing method of a semiconductor device according to claim 1 , wherein the step (c) is performed after the step (b).
3. The manufacturing method of a semiconductor device according to claim 1 , wherein the step (b) is performed after the step (c).
4. The manufacturing method of a semiconductor device according to claim 1 , further comprising the step of: after the step (c), performing heat treatment.
5. The manufacturing method of a semiconductor device according to claim 1 , wherein the field effect transistor is an n channel MISFET.
6. The manufacturing method of a semiconductor device according to claim 1 , wherein the field effect transistor is a p channel MISFET.