Wafer for electrical connector
A daughter card is constructed with a housing and a plurality of wafers retained in the housing. Each wafer includes a lead frame having a plurality of signal and ground terminals where the signal terminals are a differential pair. The lead frame includes an insulative frame portion with a conductive shield positioned on a side of the lead frame. The shield is secured to the lead frame by a projection extending from the shield to the ground terminals.
1. A wafer comprising:
a lead frame, the lead frame including a plurality of signal terminals and a plurality of ground terminals, the ground terminals having a body portion, a mounting portion disposed at a first end of the body portion and a connection portion disposed at a second end of the body portion, the ground terminal including an opening formed in the body portion with the opening including opposing edges; and
a shield disposed on a side of the lead frame, a projection extending from the shield, the projection includes a pair of fingers with a space between the fingers, each finger having a side portion that engages the edges of the opening in the ground terminal.
2. The wafer of claim 1 , wherein the fingers are deformed by enlarging the space.
3. The wafer of claim 1 , wherein a transition section is formed at the base of the fingers.
4. The wafer of claim 3 , wherein the transition is position abuts the edges of the opening.
5. A method for producing a wafer comprising:
providing lead frame, having a pair of signal terminals and a ground terminal, the ground terminal having a hole with opposing edges;
molding a housing over the lead frame;
placing a shield over a side of the lead frame, the shield including a projection, the projection having a pair of spaced apart fingers, each finger having a side portion; and
securing the shield to the lead frame wherein the side portions of each finger of the projection engages the opposing edges of the hole in the ground terminal.
6. The method for producing a wafer according to claim 5 , wherein securing the shield to the wafer is accomplished by deforming the side portions of the projection.