Casing, electronic device employing same and manufacturing method
A casing includes a cover and a frame coupled to the cover. The frame includes a base body and a plurality of non-conductive portions. The base body defines a plurality of gaps spaced from each other. The non-conductive portions are correspondingly inserted into the gaps to insulate opposite sides of each gap. A manufacturing method and an electronic device of the casing are also provided.
1. A casing comprising:
a cover; and
a frame coupled to the cover and comprising:
a base body defining a plurality of gaps spaced from each other, each gap having opposite sides; and
a plurality of non-conductive portions correspondingly inserted into the gaps to insulate the opposite sides of each gap;
wherein the base body defines a groove corresponding to the gaps and comprises a thin portion corresponding to the groove, the gaps are defined through the thin portion.
2. The casing as claimed in claim 1 , wherein the base body comprises a first surface and a second surface opposite to the first surface, the groove is defined in the first surface or the second surface.
3. The casing as claimed in claim 2 , wherein a thickness of the thin portion is 0.3-0.5 millimeter.
4. The casing as claimed in claim 1 , wherein the gaps divide the base body into a plurality of metal pieces and base portions, the metal pieces and base portions adjacent to the metal pieces are connected via the non-conductive portions.
5. The casing as claimed in claim 4 , wherein a width of each gap and each non-conductive portion is 0.03-0.15 millimeter.
6. The casing as claimed in claim 4 , wherein each metal piece and each base portion define a plurality of nano holes on a surface connected to the non-conductive portion, each non-conductive portion comprises a plurality of ribs configured to engage to the nano holes of the metal piece and the base portion.
7. The casing as claimed in claim 6 , wherein a diameter of the nano holes is 40-60 nanometer.
8. The casing as claimed in claim 6 , wherein the frame further comprises a combination layer configured to couple the metal pieces, the base portions, and the non-conductive portions together.
9. The casing as claimed in claim 8 , wherein the each metal piece and each base portion define a plurality of nano holes on a surface connected to the combination layer, the combination layer comprises a plurality of ribs portions configured to engage to the nano holes of the metal piece and the base portion.
10. The casing as claimed in claim 9 , wherein the frame further comprises a connecting layer configured to couple the combination layer to the base portions; each base portion define a plurality of nano holes on a surface connected to the connecting layer, the connecting layer comprises a plurality of ribs sections configured to engage to the nano holes of the base portion.
11. An electronic device comprising:
a main body;
a frame comprising:
a base body defining a plurality of gaps spaced from each other, each gap having opposite sides;
wherein the base body defines a groove corresponding to the gaps and comprises a thin portion corresponding to the groove, the gaps are defined through the thin portion; and
a plurality of non-conductive portions correspondingly inserted into the gaps to insulate the opposite sides of each gap;
a cover coupling the frame to the main body; and
an antenna corresponding to the non-conductive portions.
12. The electronic device as claimed in claim 11 , wherein the base body is coupled to the antenna to be an extra part of the antenna, signals transmitted and received by the antenna pass through the non-conductive portion.
13. The electronic device as claimed in claim 11 , wherein the gaps divide the base body into a plurality of metal pieces and base portions, the metal pieces and base portions adjacent to the metal pieces are connected via the non-conductive portions.