Frameless display device with concealed drive circuit board and manufacturing method thereof
The present invention provides a frameless display device and a manufacturing method thereof, in which a conductive connection body is formed on a substrate; a first via is formed in a protective layer to be located above the conductive connection body and a second via hole is formed in the substrate to be located under the conductive connection body. A circuit layout layer is connected through the first via with the conductive connection body and a flexible connection circuit connected to a drive circuit board is connected through the second via with the conductive connection body thereby achieving electrical connection between the drive circuit board and the circuit layout layer. The method is simple and easy to operate and in a frameless display device so manufactured, the flexible connection circuit and the drive circuit board are both arranged at a back side of the substrate without occupying an effective display zone thereby achieving frameless displaying and improving displaying quality.
1. A manufacturing method of a frameless display device, comprising the following steps:
(1) providing a substrate and forming a conductive connection body on the substrate;
(2) depositing and patterning a protective layer on the substrate and the conductive connection body, forming a first via in the protective layer to be located above and correspond to the conductive connection body, forming a circuit layout layer on the protective layer, so that the circuit layout layer is set in engagement with and electrically connected to the conductive connection body through the first via;
(3) forming an organic light emitting diode (OLED) emission layer or a package layer on the circuit layout layer;
(4) forming a second via in the substrate through laser holing to be located under and correspond to the conductive connection body; and
(5) providing a drive circuit board and a flexible connection circuit and arranging the drive circuit board and the flexible connection circuit adjacent to one side of the substrate that is distant from the circuit layout layer, wherein the flexible connection circuit has an end electrically connected to the drive circuit board and an opposite end extending from an underside of the substrate through the second via to engage and electrically connect with the conductive connection body so as to be connected by the conductive connection body to the circuit layout layer to achieve electrical connection between the drive circuit board and the circuit layout layer;
wherein the drive circuit board is separate from the substrate with spacing therebetween and the drive circuit board is connected by the flexible connection circuit that extends through the spacing and the second via to the conductive connection body formed on the substrate.
2. The manufacturing method of the frameless display device as claimed in claim 1 , wherein the substrate is a flexible substrate.
3. The manufacturing method of the frameless display device as claimed in claim 1 , wherein the conductive connection body comprises a material of metal.
4. The manufacturing method of the frameless display device as claimed in claim 1 , wherein the conductive connection body is set in a middle area of the substrate.
5. The manufacturing method of the frameless display device as claimed in claim 4 , wherein a frameless display device is formed in step (5) and is a top emission OLED display device.