IP Library › Granted Patent US 9,745,498
Granted Patent B2
US 9,745,498 · App. 14/898,701 · Granted Aug 29, 2017

Heat-storage composition

Inventors: Tomoki Matsumura (Aichi, JP); Masakazu Hattori (Aichi, JP); Seiji Niitaka (Saitama, JP); Kimitoshi Kono (Saitama, JP)
Assignees: Fuji Polymer Industries Co., Ltd.; RIKEN
C09K5/063C08K3/00C08K3/0008C08K9/06C08L101/00C09K5/00H01L23/427H01L23/4275C08K3/18C08K3/22C08K3/28C08K2003/222C08K2003/2227C08K2003/2296C08K2201/001C08K2201/005
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Quick Facts
Patent No.
US 9,745,498
App. No.
14/898,701
Granted
Aug 29, 2017
Kind
B2
Abstract

A heat storage composition ( 20 ) of the present invention includes a matrix resin ( 21 ) and heat storage inorganic particles ( 22 ). The heat storage inorganic particles ( 22 ) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles ( 23, 24 ). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.

Claims (22)

1. A heat storage composition comprising:

a matrix resin;

heat storage inorganic particles; and

heat conductive particles,

wherein the heat storage inorganic particles are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition,

an amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin,

an amount of the heat conductive particles is 100 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin,

the heat conductive particles include inorganic particles with an average particle size of 2 μm or more and inorganic particles with an average particle size of less than 2 μm,

an amount of the inorganic particles with an average particle size of 2 μm or more is 50 wt % or more when a total amount of particles is 100 wt %,

a heat conductivity of the heat storage composition is 0.3 W/m·K or more, and

the heat storage composition is provided between a heat generating member and a heat dissipating member to transfer heat in a planar direction.

2. The heat storage composition according to claim 1 , wherein the heat storage inorganic particles have an average particle size of 0.1 to 100 μm.

3. The heat storage composition according to claim 1 , wherein the matrix resin is at least one resin selected from a thermosetting resin and a thermoplastic resin.

4. The heat storage composition according to claim 3 , wherein the matrix resin is an organopolysiloxane.

5. The heat storage composition according to claim 1 , wherein the heat conductive particles are surface treated with a silane compound or its partial hydrolysate, and the silane compound is expressed by R(CH 3 ) a Si(OR′) 3−a , where R represents an alkyl group having 1 to 20 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1.

6. The heat storage composition according to claim 1 , wherein the heat storage inorganic particles are surface treated with alkoxysilane or alkyl titanate.

7. The heat storage composition according to claim 6 , wherein the alkoxysilane is a silane compound or its partial hydrolysate, and the silane compound is expressed by R(CH 3 ) a Si(OR′) 3−a , where R represents an alkyl group having 1 to 20 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1.

8. The heat storage composition according to claim 6 , wherein the alkyl titanate is tetrabutyl titanate.

9. The heat storage composition according to claim 6 , wherein the surface treatment allows alkoxysilane or alkyl titanate to be held on the heat storage inorganic particles by adsorption or a chemical bond.

10. The heat storage composition according to claim 1 , wherein the heat storage composition is formed into a sheet.

11. The heat storage composition according to claim 1 , wherein the heat storage inorganic particles are metal oxide particles containing vanadium as a main metal component.

12. The heat storage composition according to claim 1 , wherein the heat conductive particles are particles of at least one selected from alumina, zinc oxide, magnesium oxide, aluminum nitride, boron nitride, aluminum hydroxide, and silica.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 6, 2023
From: FUJI POLYMER INDUSTRIES CO., LTD.
To: FUJI POLYMER INDUSTRIES CO., LTD.
Reel/Frame 062655/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 15, 2015
From: MATSUMURA, TOMOKI; HATTORI, MASAKAZU; NIITAKA, SEIJI; KONO, KIMITOSHI
To: FUJI POLYMER INDUSTRIES CO., LTD.; RIKEN
Reel/Frame 037301/0038 →
Priority Claims (1)
JP 2014-128404 · Jun 23, 2014 · national
Continuity (1)
Related Publication 20160130492A1 · May 12, 2016