IP Library Granted Patent US 9,748,715
Granted Patent B2
US 9,748,715 · App. 14/938,210 · Granted Aug 29, 2017

Modular socket panel and layer module for modular socket panel

Inventors: Sai Man Wang (Kowloon, HK); Sek Un Fong (Kowloon, HK)
Assignee: Sipomac Technology Company Limited
H01R24/78H01R31/005H01R31/06H01R13/701H01R24/64
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Quick Facts
Patent No.
US 9,748,715
App. No.
14/938,210
Granted
Aug 29, 2017
Kind
B2
Abstract

The present invention discloses a modular socket panel which includes a bottom layer adapted to be fixed to an embedded case in a wall and adapted to be electrically connected to a power supply provided by the embedded case, and a surface layer adapted to be directly or indirectly connected to the bottom layer in a non-fastening manner. The surface layer provides a power socket, which is electrically connected to the bottom layer. The modular socket panel disclosed in the present invention enables a user to mount a middle layer and the surface layer onto the bottom layer or remove the middle layer and surface layer from the bottom layer without any tool, and also enables the user to mount different middle layers in the modular socket panel when needed to implement different functions, for example adding more intelligent functions.

Claims (17)

1. A modular socket panel, comprising:

a bottom layer adapted to be fixed to an embedded case in a wall and adapted to electrically connect to a power supply provided by the embedded case;

a middle layer disposed between the bottom layer and the surface layer; the middle layer adapted to connect to the bottom layer in a non-fastening manner;

a surface layer adapted to be directly or indirectly connected to the bottom layer by a non-fastening manner; the surface layer adapted to connect to the middle layer in a non-fastening manner;

wherein, the surface layer provides a power socket, which is electrically connected to the bottom layer;

wherein the middle layer is electrically connected to the bottom layer and the surface layer respectively; and

wherein the bottom layer has a plurality of bottom layer jacks, all of which are connected to the power supply provided by the embedded case; the middle layer having a plurality of middle layer pins that are respectively corresponding to and electrically connected to the bottom layer jacks, and a plurality of middle layer jacks connected to the middle layer pins; the surface layer having a plurality of surface layer pins that are respectively corresponding to and electrically connected to the middle layer jacks.

2. The modular socket panel according to claim 1 , wherein the middle layer is provided with at least one of the following components: an environmental sensor, a network adapter and a controller.

3. The modular socket panel according to claim 2 , wherein the environmental sensor is selected from one of the following sensors: a temperature sensor, a humidity sensor, an infrared sensor, a human body sensor, and a light sensor.

4. The modular socket panel according to claim 2 , wherein the network adapter is a powerline adapter, an Ethernet adapter, or a wireless access point.

5. The modular socket panel according to claim 2 , wherein the controller is adapted to connect with switches disposed on the surface layer, and receive the inputs generated by operations on the switches, therefore control the operation of electrical appliances external to the modular socket panel.

6. The modular socket panel according to claim 1 , wherein, the bottom layer is directly connected to the surface layer, the surface layer having a plurality of middle pins that are respectively corresponding to and electrically connected to the bottom layer jacks.

7. The modular socket panel according to claim 1 , wherein the power socket is a USB socket, which is connected to the bottom layer via an AC to DC converter.

8. The modular socket panel according to claim 1 , wherein the bottom layer is adapted to be fixed to the embedded case in the wall by screws.

9. The modular socket panel according to claim 1 , wherein a surface of the surface layer is colored.

10. The modular socket panel according to claim 1 , wherein a front side of the surface layer is in a polygonal, round, or irregular shape.

11. The modular socket panel according to claim 1 , wherein the non-fastening manner includes sliding, pull and plug, or snap-fitting.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2015
From: WANG, SAI MAN; FONG, SEK UN
To: SIPOMAC TECHNOLOGY COMPANY LIMITED
Reel/Frame 037094/0736 →
Priority Claims (1)
CN 2014 1 0631702 · Nov 11, 2014 · national
Continuity (1)
Related Publication 20160134062A1 · May 12, 2016