IP Library Granted Patent US 9,752,006
Granted Patent B2
US 9,752,006 · App. 14/972,847 · Granted Sep 5, 2017

Polyamide resin composition and molded article

Inventors: Teruaki Sakuma (Tokyo, JP); Kazunori Terada (Tokyo, JP)
Assignee: ASAHI KASEI KABUSHIKI KAISHA
C08K3/16C08K5/17C08K3/0033C08K5/098
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Quick Facts
Patent No.
US 9,752,006
App. No.
14/972,847
Granted
Sep 5, 2017
Kind
B2
Abstract

A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).

Claims (15)

1. A polyamide resin composition comprising:

a polyamide resin (A) in 64.05 to 99.86% by mass with respect to 100% by mass of the polyamide resin composition,

a copper compound (B) in 0.03 to 0.1% by mass with respect to 100% by mass of the polyamide resin composition, wherein the copper compound (B) is a copper halide compound,

a bromide of an alkali metal (C) in 0.05 to 5% 0.17 to 0.6% by mass with respect to 100% by mass of the polyamide resin composition, and

a secondary amine compound (D) comprising an aromatic secondary amine compound in 0.1 to 0.2% by mass with respect to 100% by mass of the polyamide resin composition,

wherein the mass ratio of the bromide of an alkali metal (C) to the secondary amine compound (D) in the polyamide resin composition is 50/1 to 1/50.

2. The polyamide resin composition according to claim 1 , wherein a molar ratio of a halogen element/a copper element, in the polyamide resin composition is 2/1 to 50/1.

3. The polyamide resin composition according to claim 1 , further comprising at least one fatty acid compound (E) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts.

4. The polyamide resin composition according to claim 3 , wherein the fatty acid compound (E) has an acid value of 10 mgKOH/g or less.

5. The polyamide resin composition according to claim 3 , wherein the fatty acid compound (E) is a higher fatty acid metal salt with a metal content of 3.5 to 11.5% by mass.

6. The polyamide resin composition according to claim 1 , wherein the content of the copper element in the polyamide resin composition is 0.005% by mass or more with respect to the total mass of the polyamide resin composition.

7. The polyamide resin composition according to claim 1 , further comprising an inorganic filler (F).

8. A molded article comprising a polyamide resin composition according to claim 1 .

9. The molded article according to claim 8 , wherein the molded article is a vehicle part.

10. The polyamide resin composition according to claim 1 , further comprising at least one fatty acid compound (E) in 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE CONVEYING PARTIES PREVIOUSLY RECORDED AT REEL: 038817 FRAME: 0847. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Jun 21, 2016
From: ASAHI KASEI FIBERS CORPORATION; ASAHI KASEI CHEMICALS CORPORATION; ASAHI KASEI E-MATERIALS CORPORATION
To: ASAHI KASEI KABUSHIKI KAISHA
Reel/Frame 039098/0978 →
MERGER Recorded Jun 6, 2016
From: ASAHI KASEI E-MATERIALS CORPORATION; ASAHI KASEI CHEMICALS CORPORATION
To: ASAHI KASEI KABUSHIKI KAISHA
Reel/Frame 038817/0847 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2016
From: SAKUMA, TERUAKI; TERADA, KAZUNORI
To: ASAHI KASEI CHEMICALS CORPORATION
Reel/Frame 037768/0255 →
Priority Claims (1)
JP 2014-256479 · Dec 18, 2014 · national
Continuity (1)
Related Publication 20160177049A1 · Jun 23, 2016