Composition for metal electroplating comprising leveling agent
A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant, wherein D 6 is, for each repeating unit 1 to s independently, a divalent group selected from a saturated or unsaturated C 1 -C 20 organic radical, D 7 is, for each repeating unit 1 to s independently, a divalent group selected from straight chain or branched C 2 -C 20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR 10 , R 1 is, for each repeating unit 1 to s independently, selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R 2 , may form a divalent group D 8 , and R 2 is, for each repeating unit 1 to s independently, selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R 1 , may form a divalent group D 8 , and D 8 is selected from straight chain or branched C 1 -C 18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR 10 , s is an integer from 1 to 250, R 10 is selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.
1. A composition, comprising:
a source of metal ions,
at least one additive comprising at least one polyaminoamide comprising a structural unit represented by the formula I:
or a derivative of the polyaminoamide of the formula I obtained by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,
wherein
D 6 is selected from a straight chain or branched, acyclic or cyclic C 1 -C 20 alkanediyl, wherein D 6 is the same or different when s is more than 1,
D 7 is a divalent group selected from straight chain or branched C 2 -C 20 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR 10 , wherein D 7 is the same or different when s is more than 1,
R 1 is selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R 2 , may form a divalent group D 8 , wherein R 1 is the same or different when s is more than 1,
R 2 is selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, or, together with R 1 , may form a divalent group D 8 , wherein R 2 is the same or different when s is more than 1,
D 8 is selected from straight chain or branched C 1 -C 18 alkanediyl, which may optionally be interrupted by heteroatoms or divalent groups selected from O, S and NR 10 ,
s is an integer from 1 to 250, and
R 10 is selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl, and
an accelerating agent.
2. The composition according to claim 1 , wherein the polyaminoamide is represented by the formula IV:
wherein
E 3 , E 4 are independently selected from the group consisting of:
(a) NH—C 1 -C 20 -alkyl or NH—C 1 -C 20 -alkenyl,
(b) N—(C 1 -C 20 -alkyl) 2 or N—(C 1 -C 20 -alkenyl) 2 or N—(C 1 -C 20 -alkyl)(C 1 -C 20 -alkenyl)
(c) NR 2 -D 7 -NR 2 H, and
(d) NR 2 -D 7 -NR 2 —CH 2 —CH 2 —CO—NH—(C 1 -C 20 -alkyl) or NR 2 -D 7 -NR 2 —CH 2 —CH 2 —CO—NH—(C 1 -C 20 -alkenyl).
3. The composition according to claim 2 , wherein E 3 and E 4 are independently defined as NR 1 -D 7 -NR 2 H.
4. The composition according to claim 1 , wherein the metal ions comprise copper ion.
5. The composition according to claim 1 , wherein:
D 6 is (CH 2 ) g , and
g is an integer from 1 to 6.
6. The composition according to claim 1 , wherein D 7 is a straight chain C 2 - to C 6 -alkanediyl.
7. The composition according to claim 1 , wherein s is an integer from 1 to 150.
8. The composition according to claim 1 , wherein R 1 is selected from the group consisting of H, C 1 -C 20 -alkyl, and C 1 -C 20 -alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.
9. The composition according to claim 1 , wherein R 2 is selected from the group consisting of H, C 1 -C 20 -alkyl, and C 1 -C 20 -alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.
10. The composition according to claim 1 , wherein R 1 and R 2 together form a divalent group D 8 , with D 8 being a straight chain or branched C 1 -C 18 alkanediyl, which may optionally be interrupted by at least one heteroatom or divalent group selected from the group consisting of O, S and NR 10 , with R 10 being selected from H, C 1 -C 20 alkyl, and C 1 -C 20 alkenyl, which may optionally be substituted by hydroxyl, alkoxy or alkoxycarbonyl.
11. The composition according to claim 1 , further comprising a suppressing agent.
12. The composition according to claim 1 , wherein s is an integer from 2 to 100.
13. The composition according to claim 1 , wherein s is an integer from 2 to 50.
14. A process for depositing a metal layer on a substrate, the process comprising:
a) contacting a metal plating bath comprising the composition according to claim 1 with a substrate; and
b) applying a current density to the substrate for a time sufficient to deposit a metal layer onto the substrate.
15. The process according to claim 14 , wherein the substrate comprises micrometer or nanometer sized features and the deposition is performed to fill the micrometer or nanometer sized features.
16. The process according to claim 15 , wherein the nanometer-sized features have
a size from 1 to 1000 nm,
an aspect ratio of 4 or more,
or both.