Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby
One embodiment of the present disclosure provides a method for producing a substrate formed with a copper thin layer. The method includes providing a carrier, forming a separation-inducing layer on the surface of the carrier, forming a copper thin layer on the separation-inducing layer, and bonding a core to the copper thin layer.
1. A method for producing a substrate formed with a copper thin layer, the method comprising:
providing a carrier;
forming a separation-inducing layer on the surface of the carrier;
forming the copper thin layer on the separation-inducing layer; and
bonding a core to the copper thin layer,
wherein the carrier is made of aluminum, and the separation-inducing layer is formed by forming a porous layer comprising aluminum from the surface of the carrier and applying a sealing agent to the porous layer.
2. The method according to claim 1 , wherein the porous layer is formed on the carrier surface from the surface of the carrier using a solution comprising at least one compound selected from the group consisting of alkali compounds, iron compounds, and carbonate compounds.
3. The method according to claim 1 , wherein the porous layer is formed on the carrier surface from the surface of the carrier by electroless etching.
4. The method according to claim 1 , wherein the sealing agent applied to the surface of the carrier formed with the porous layer comprises at least one material selected from the group consisting of cobalt-chromium, metal-polymer composites, boron nitride, molybdenum disulfide, and polytetrafluoroethylene.
5. A method for manufacturing a printed circuit board, the method comprising:
providing a substrate formed with a copper thin layer produced by the method according to claim 1 ;
separating the carrier on the separation-inducing layer from the copper thin layer of the substrate by chemical etching;
forming a mask for pattern formation on the copper thin layer, and
forming a copper pattern on the copper thin layer by electroplating;
removing the mask for pattern formation; and
removing the copper thin layer to leave a patterned copper circuit.
6. The method according to claim 1 , further comprising separating the carrier on the separation-inducing layer from the copper thin layer of the substrate by chemical etching.
7. The method according to claim 6 , wherein the step of bonding the core to the copper thin layer is performed by thermal pressing.