Passive noise-cancellation of an in-ear headset module

1. An in-ear headset module, comprising:

a housing, having a chamber and an audio outlet communicated with the chamber;

an earpad, disposed outside the housing;

a speaker unit, disposed in the chamber; and

a microphone, disposed in the chamber and located between the audio outlet and the speaker unit, wherein a diameter of the microphone is smaller than or equal to 6 mm, and a contact between the speaker unit and the chamber is an airtight contact.

2. The in-ear headset module as recited in claim 1 , wherein the speaker unit separates the chamber into a front chamber and a rear chamber and prevents air from flowing between the front chamber and the rear chamber, and the microphone is located in the front chamber.

3. The in-ear headset module as recited in claim 1 , further comprising a moisture-proof air-permeable element disposed at the audio outlet.

4. The in-ear headset module as recited in claim 1 , wherein a moisture-proof air-permeable element is disposed at an audio inlet of the microphone.

5. The in-ear headset module as recited in claim 1 , wherein the earpad is disposed outside the audio outlet of the housing and forms a channel communicated with the audio outlet, a size of the channel is maintained constant or increased from an end close to the audio outlet to an end far from the audio outlet.

6. The in-ear headset module as recited in claim 1 , wherein a diameter of the speaker unit is smaller than or equal to 6 mm.

7. The in-ear headset module as recited in claim 1 , wherein the microphone is a condenser microphone.

8. The in-ear headset module as recited in claim 1 , wherein a channel is formed between the microphone and a wall of the chamber and configured to transmit sound provided from the speaker unit through the channel to outside the audio outlet.

9. The in-ear headset module as recited in claim 1 , further comprising a Bluetooth communication unit electrically connecting to the speaker unit and the microphone, wherein the Bluetooth communication unit has an echo cancelling circuit.

10. The in-ear headset module as recited in claim 1 , further comprising a Bluetooth communication unit electrically connecting to the speaker unit and the microphone, wherein the Bluetooth communication unit has a microphone high pass filter circuit, and a cutoff frequency of the microphone high pass filter circuit is greater than or equal to 300 Hz.

11. The in-ear headset module as recited in claim 1 , further comprising a Bluetooth communication unit electrically connecting to the speaker unit and the microphone, wherein the Bluetooth communication unit has a microphone high pass filter circuit, and a slope of the microphone high pass filter circuit is greater than or equal to 3 dB/octave.

12. The in-ear headset module as recited in claim 1 , wherein the housing is integrally formed, and a maximum outer diameter of the housing is smaller than or equal to 8 mm.

13. The in-ear headset module as recited in claim 1 , wherein an audio inlet of the microphone is directly opposite the audio outlet.

14. The in-ear headset module as recited in claim 1 , further comprising a printed circuit board, wherein the printed circuit board is engaged in the chamber, the microphone is soldered on the printed circuit board, and a channel is formed between the printed circuit board and a wall of the chamber and configured to transmit sound provided from the speaker unit through the channel to outside the audio outlet.

15. The in-ear headset module as recited in claim 1 , further comprising a microphone lead wire, wherein a wire slot is formed on a wall of the chamber, the microphone lead wire electrically connects with the microphone and extends through the wire slot to outside.