Laser processing method
It comprises a first step of preparing an object; a second step of forming a modified region in a first member along a line by irradiating the first member with laser light while using a front face of the object as a laser light entrance surface; a third step of forming a processing scar in a bonding layer along the line by irradiating the bonding layer with laser light while using the front face as a laser light entrance surface; and a fourth step, after the first to third steps, of forming a modified region in a second member along the line by irradiating the second member with laser light while using a rear face of the object as a laser light entrance surface; the fourth step uses the processing scar as a reference for alignment of a laser light irradiation position with respect to the second member.
1. A laser processing method comprising:
a first step of preparing an object to be processed having first and second planar members stacked on top of each other and a bonding layer, arranged between the first and second planar members, bonding the first and second planar members to each other, the object being set with a line to process;
a second step of forming a modified region in the first planar member along the line by irradiating the first planar member with laser light along the line while using a front face of the object on a side opposite from the bonding layer in the first planar member as a laser light entrance surface;
a third step of forming a processing scar in the bonding layer along the line by irradiating the bonding layer with laser light along the line while using the front face of the object as a laser light entrance surface; and
a fourth step, after the first to third steps, of forming a modified region in the second planar member along the line by irradiating the second planar member with laser light along the line while using a rear face of the object on a side opposite from the bonding layer in the second planar member as a laser light entrance surface;
wherein the fourth step irradiates the second planar member with the laser light along the line by using the processing scar formed in the bonding layer as a reference for alignment of a laser light irradiation position with respect to the second planar member.
2. A laser processing method according to claim 1 , wherein the modified region is formed in the first planar member by performing the second step after forming the processing scar in the bonding layer by performing the third step.
3. A laser processing method according to claim 1 , wherein the third step is performed by irradiating the bonding layer with leak light of the laser light irradiating the first planar member when performing the second step, so as to form the processing scar in the bonding layer.