Multi-level micromechanical structure
The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.
1. A micromechanical device, comprising:
a device layer comprising only homogenous device wafer material and having a top surface on a first side of the device layer and a bottom surface on a second side of the device layer, wherein the top surface and the bottom surface are on two opposite sides of the device layer, wherein the device layer comprises a multi-level comb structure having at least a rotor and at least two stators, and
wherein at least some of the rotor and at least two stators are at least partially recessed to at least two different non-zero depths of recession from the top surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different non-zero depths of recession from the bottom surface of the device layer.
2. The micromechanical device according to claim 1 , wherein the rotor and at least two stators comprise a comb structure having a double linear response function, where a change of the output value of a first electrode pair formed by a first stator and the rotor is opposite to a change of the output value of a second electrode pair formed by a second stator and the rotor.
3. The micromechanical device according to claim 1 , wherein an area of linearly changing response functions of a first electrode pair formed by a first stator and the rotor and a second electrode pair formed by a second stator and the rotor is defined by a relative thickness of the respective stator and rotor in the respective electrode pair, and by the amount of vertical overlap between the stator and the rotor in each respective electrode pair in equilibrium position, wherein the relative thicknesses and the vertical overlap of the electrode pairs are defined by the amount of recession of the structures from the first or the bottom surface of the device layer.
4. The micromechanical device according to claim 3 , wherein at least one of the stators and the rotor overlap in an equilibrium position in vertical dimension for an amount that is less than the vertical thickness of a comb finger of the at least one stator and less than the vertical thickness of a comb finger of the rotor.
5. The micromechanical device according to claim 1 , wherein a center part of the rotor is recessed less below at least one surface of the device layer than at least one finger of the rotor recessed below the at least one surface of the device layer.
6. The micromechanical device according to claim 1 , wherein a center part of the rotor is recessed more below at least one surface of the device layer than at least one finger of the rotor recessed below the at least one surface of the device layer.