Apparatus and method for selective deposition
Methods and apparatus for processing a substrate are described herein. Methods for passivating dielectric materials include forming alkyl silyl moieties on exposed surfaces of the dielectric materials. Suitable precursors for forming the alkyl silyl moieties include (trimethylsilyl)pyrrolidine, aminosilanes, and dichlorodimethylsilane, among others. A capping layer may be selectively deposited on source/drain materials after passivation of the dielectric materials. Apparatus for performing the methods described herein include a platform comprising a transfer chamber, a pre-clean chamber, an epitaxial deposition chamber, a passivation chamber, and an atomic layer deposition chamber.
1. A substrate processing method, comprising: delivering a substrate to
a first processing chamber disposed on a platform and performing a pre-clean process on the substrate; transferring the substrate from the first processing chamber to a second processing chamber disposed on the platform without breaking vacuum; performing an epitaxial deposition process to deposit source/drain materials on the substrate in the second processing chamber;
transferring the substrate from the second processing chamber to a third processing chamber disposed on the platform without breaking vacuum; performing a surface passivation process to modify surfaces of dielectric materials disposed on the substrate, wherein the surface passivation process deposits an alkyl silyl material on the dielectric materials; transferring the substrate from the third processing chamber to a fourth processing chamber disposed on the platform without breaking vacuum; and depositing a capping layer on the source/drain material, wherein the capping layer is a metal oxide material deposited by an atomic layer deposition process.
2. The method of claim 1 , wherein the pre-clean process comprises exposing the substrate to a plasma comprising H, NF3, and NH3.
3. The method of claim 1 , wherein the epitaxial deposition process deposits one or more of a silicon material, a silicon germanium material, a silicon phosphorous material, or a carbon material.
4. The method of claim 1 , wherein the surface passivation process selectively passivates exposed surfaces of the dielectric materials.
5. The method of claim 1 , wherein precursors for the alkyl silyl material are selected from the group consisting of (trimethylsilyl)pyrrolidine, dichlorodimethylsilane, aminosilane, grafts thereof, and combinations thereof.
6. The method of claim 1 , wherein the capping layer has a thickness of between about 1 nm and about 10 nm.
7. The method of claim 1 , wherein the capping layer is selected from the group consisting of aluminum oxide, hafnium oxide, zirconium oxide, manganese oxide, and silicon nitride.