Improving the strength of micro-bump joints
A device includes a work piece including a metal bump; and a dielectric layer having a portion directly over the metal bump. The metal bump and a surface of the portion of the dielectric layer form an interface. A metal finish is formed over and contacting the metal bump. The metal finish extends from over the dielectric layer to below the interface.
1. A bump structure comprising:
a metal pad comprising a second copper layer overlying a first copper layer, the second copper layer having a recess extending partially into the second copper layer with a portion of the second copper layer being below a lowermost surface of the recess;
a passivation layer over the metal pad, the passivation layer having an opening exposing a portion of the metal pad; and
a metal bump over the metal pad, the metal bump having a lip extending laterally beneath a lowermost surface of the passivation layer, the lip anchoring the metal bump to the passivation layer.
2. The bump structure of claim 1 , wherein the lip has a recess depth measured from a sidewall of the passivation layer to a distal end of the lip, the recess depth greater than zero micrometers.
3. The bump structure of claim 1 , wherein the passivation layer comprises silicon nitride.
4. The bump structure of claim 1 , wherein the metal bump comprises one of nickel, Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Electroless Nickel Immersion Gold (ENIG), and Direct Immersion Gold (DIG).
5. The bump structure of claim 1 , wherein the metal pad comprises copper, aluminum, silver, and alloys thereof.
6. The bump structure of claim 1 , wherein the bump structure is supported by a bottom die, the bottom die configured to be joined with a top die to form a bump joint.
7. The bump structure of claim 1 , wherein the metal pad has a recess, the recess extending below the passivation layer, wherein the metal bump is positioned in the recess.
8. A structure comprising:
a top die including a first bump structure; and
a bottom die mounted to the top die, the bottom die including a second bump structure, the second bump structure comprising:
a metal pad, the metal pad comprising:
a nickel layer;
a copper seed layer over and contacting the nickel layer; and
a metal layer over and contacting the copper seed layer, the metal layer having a recess extending partially into the metal layer with a portion of the metal layer being below a lowermost surface of the recess; and
a metal bump over and contacting the metal layer in the recess with a lip extending laterally beneath a lowermost surface of a passivation layer, the lip anchoring the metal bump to the passivation layer, the recess extending under the passivation layer.
9. The structure of claim 8 further comprising:
a solder joint joining the first bump structure to the metal bump.
10. The structure of claim 8 , wherein the metal layer comprises copper, aluminum, silver, and alloys thereof.
11. The structure of claim 8 , wherein the passivation layer comprises silicon nitride.
12. The structure of claim 9 , wherein the metal bump comprises one of nickel, Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Electroless Nickel Immersion Gold (ENIG), and Direct Immersion Gold (DIG).
13. A method comprising:
forming an opening in a passivation layer to expose a metal pad on an integrated circuit die;
etching the metal pad to form an undercut beneath the passivation layer; and
forming a bump on the metal pad, the bump having a lip projecting into the undercut, the lip of the bump physically contacting a lower surface of the passivation layer in the undercut for a first width, the first width being greater than 0.5 μm, the bump being configured to be directly connected to an external device.
14. The method of claim 13 , wherein the etching comprises a wet etch process.
15. The method of claim 13 , wherein the metal pad has a concave top surface after the etching.
16. The method of claim 13 further comprising:
attaching the bump on the integrated circuit die to a bump structure on the external device using a solder joint.
17. The method of claim 13 , wherein the step of etching the metal pad to form an undercut beneath the passivation layer is performed using the passivation layer as a self-aligned mask, with no additional mask formed over the passivation layer.
18. The method of claim 13 , wherein etching the metal pad to form an undercut beneath the passivation layer further forms a recess in the metal pad, wherein the recess comprises a plurality of isolated portions isolated from each other by un-etched portions of the metal pad.
19. The bump structure of claim 1 , wherein the lip of the metal bump contacts the lowermost surface of the passivation layer for a first width, the first width being greater than 0.5 μm.