Pad structure layout for semiconductor device
A semiconductor device including a light sensing region disposed on a substrate is provided that includes a bond structure having one or more patterned layers underlying the pad element. The pad element may be coupled to the light sensing region and may be formed in a first metal layer disposed on the substrate. A second metal layer of the device has a first bond region, a region of the second metal layer that underlies the pad element. This first bond region of the second metal layer includes a pattern of a plurality of conductive lines interposed by dielectric. A via connects the pad element and the second metal layer.
1. A semiconductor device, comprising:
a light sensing region disposed on a substrate; and
a pad element coupled to the light sensing region, wherein the pad element is formed in a first metal layer disposed on the substrate;
a second metal layer disposed on the substrate and having a first region vertically underlying the pad element, wherein the first region of the second metal layer includes a first pattern of a plurality of conductive lines that define a first plurality of polygons including a first polygon and a second polygon, each polygon of the first plurality of polygons having N sides within a first plane defined by the second metal layer, wherein each polygon of the first plurality of polygons is concentric with one another,
wherein a first dielectric material is disposed in a first area enclosed by the first polygon, and
wherein a second dielectric material is disposed in a second area enclosed by the second polygon,
a first via vertically underlying the pad element and disposed on the first polygon, wherein a bottom surface of the first via physically contacts a top surface of the first polygon, and wherein the first polygon is electrically connected to the pad element by a first contiguous conductive path, wherein the first contiguous conductive path includes the first via,
wherein the second polygon is electrically connected to the pad element by a second contiguous conductive path;
a third metal layer disposed on the substrate and having a second region vertically underlying the pad element, wherein the second region of the third metal layer includes a second pattern of a plurality of conductive lines that define a second plurality of polygons, each polygon of the second plurality of polygons having one of N+1 sides and N−1 sides within a second plane defined by the third metal layer, wherein each polygon of the second plurality of polygons is concentric with one another; and
a second via connecting the second region of the third metal layer and the first region of the second metal layer.
2. The semiconductor device of claim 1 , wherein
the first metal layer is disposed nearer a surface of the substrate than the second metal layer; and
the pad element is disposed on a peripheral region of the substrate.
3. The semiconductor device of claim 1 , further comprising a wire bond attached to the pad element.
4. The semiconductor device of claim 1 ,
wherein the second pattern of the plurality of conductive lines is configured to define a plurality of enclosed areas in the second region.
5. The semiconductor device of claim 1 , further comprising:
a top metal layer disposed on the substrate, wherein the top metal layer is disposed further from a substrate top surface than the first and second metal layers.
6. The semiconductor device of claim 5 , further comprising:
a second substrate bonded to the top metal layer of the substrate having the light sensing region.
7. A back-side illuminated sensor device, comprising:
a first substrate having a first surface and an opposing second surface;
a lens disposed on the first surface, operable to direct an incident radiation beam toward a light sensing region disposed in the first substrate;
a multi-layer interconnect (MLI) disposed on the second surface of the first substrate, wherein the MLI includes a first metal layer, a second metal layer and a plurality of vias connecting the first and second metal layers; and
a bond structure disposed on a peripheral region of the first substrate, the bond structure including:
a pad element co-planar with the first metal layer of the MLI;
a first pattern of conductive material coplanar with the second metal layer of the MLI, wherein the first pattern vertically underlies the pad element and provides a first region vertically underlying the pad element that has a conductive density of less than 100%, wherein the first pattern of conductive material includes a first conductive ring and a second conductive ring nonconcentric with the first conductive ring, wherein a first dielectric material is disposed in a first area enclosed by the first conductive ring, and wherein a second dielectric material is disposed in a second area enclosed by the second conductive ring;
a first via vertically underlying the pad element and disposed on the first conductive ring, wherein a top surface of the first via physically contacts a bottom surface of the pad element, and wherein the first conductive ring is electrically connected to the pad element by a first contiguous conductive path, wherein the first contiguous conductive path includes the first via;
a second via vertically underlying the pad element and disposed on the second conductive ring, wherein a top surface of the second via physically contacts the bottom surface of the pad element, and wherein the second conductive ring is electrically connected to the pad element by a second contiguous conductive path including the second via;
a second pattern of conductive material coplanar with a third metal layer of the MLI, wherein the second pattern vertically underlies the pad element, and wherein the second pattern includes a third conductive ring and a fourth conductive ring nonconcentric with the third conductive ring, wherein a third dielectric material is disposed in a third area enclosed by the third conductive ring, and wherein a fourth dielectric material is disposed in a fourth area enclosed by the fourth conductive ring;
wherein the first and second conductive rings include N-sided polygons, and
wherein the third and fourth conductive rings include M-sided polygons, M being different from N.
8. The back-side illuminated sensor device of claim 7 , wherein the first metal layer is a nearest metal layer to the first surface of the first substrate; and the first and second conductive rings are vertically aligned with the pad element.
9. The back-side illuminated sensor device of claim 7 , further comprising:
a bonding element connecting a second substrate to the first substrate, wherein the bonding element is connected to a top metal layer of the MLI.
10. The back-side illuminated sensor device of claim 9 , further comprising:
a logic device disposed on the second substrate and electrically connected to the MLI of the first substrate.
11. The back-side illuminated sensor device of claim 7 , at least one of a wedge bond and a ball bond attached to the pad element.
12. The back-side illuminated sensor device of claim 7 , a light sensing region extending from the first surface of the first substrate into the first substrate.
13. The back-side illuminated sensor device of claim 7 ,
wherein a first outer sidewall of the first conductive ring and a second outer sidewall of a second conductive ring are connected by a conductive path coplanar with the first and second conductive rings.
14. The back-side illuminated sensor device of claim 7 , wherein the first and second conductive rings are connected by a conductive line coplanar with the first and second conductive rings.
15. The back-side illuminated sensor device of claim 7 ,
the third metal layer of the MLI is adjacent to the second metal layer, and wherein a difference between N and M is greater than at least one.
16. A semiconductor device, comprising:
a light sensing region disposed in a first substrate, wherein the first substrate has a first surface and an opposing second surface;
a lens disposed over the first surface and aligned with the light sensing region;
a multi-layer interconnect (MLI) disposed over the second surface of the first substrate, wherein the MLI includes a first metal line nearest the second surface of the first substrate and a second metal line over the first metal line and nearer the second surface of the first substrate;
a pad element coplanar with the first metal line;
a metal feature vertically underlying the pad element and coplanar with the second metal line of the MLI, wherein the metal feature includes a first pattern of a plurality of conductive lines interposed by dielectric, and wherein the plurality of conductive lines includes:
a first set of conductive lines forming a plurality of first shapes; and
a second set of conductive lines forming a plurality of second shapes, wherein the plurality of first shapes and the plurality of second shapes are nonconcentric and arranged in an array, wherein the first shape is an N-sided polygon and the second shape is an M-sided polygons, M and N being different integers; and
a first via vertically underlying the pad element and disposed on a first conductive line of the first set of conductive lines, wherein a bottom surface of the first via physically contacts a top surface of the first conductive line, and wherein the first conductive line is electrically connected to the pad element by a contiguous conductive path including the first via,
wherein a second conductive line of the second set of conductive lines is electrically connected to the pad element by a second contiguous conductive path including a second via vertically underlying the pad element and disposed on the second conductive line; and
a top metal feature disposed on the first substrate, wherein the top metal feature is vertically aligned with the pad element, wherein the top metal feature includes a top pattern of a plurality of conductive lines interposed by dielectric, wherein the top pattern includes a first conductive ring and a second conductive ring coplanar with the first conductive ring, wherein the first and second conductive rings are nonconcentric, and wherein the top metal feature is bonded to a second substrate using a bonding element;
a second metal feature vertically underlying the pad element and coplanar with a third metal line of the MLI, wherein the second metal feature includes a second pattern of a plurality of conductive lines configured in a plurality of nonconcentric conductive circles.
17. The semiconductor device of claim 16 ,
wherein a difference between N and M is greater than at least three.
18. The semiconductor device of claim 16 ,
wherein a second bonding element is coplanar with the light sensing region.
19. The semiconductor device of claim 16 , wherein the first and second shapes are a pair of polygons selected from the group consisting of a pair of pentagons and a pair of hexagons.