Moldable earpiece system

1. A moldable earpiece for an in-ear device, comprising:

an earpiece having an external surface disposed in a first fixed configuration, said earpiece in said first fixed configuration having a passage which communicates between a first location and a second location on said external surface of said earpiece and releasably retains said in-ear device, said earpiece in said first fixed configuration heatable to achieve a moldable condition which allows reconfiguration of said external surface by engagement with an auricle of an ear, said earpiece coolable while engaged with said auricle of said ear to dispose said external surface in a second fixed configuration which releasably retains said in-ear device in said passage.

2. The moldable earpiece of claim 1 , further comprising a conduit which communicates between said first location and said second location on said external surface of said earpiece, said conduit having a conduit external surface which engages said earpiece and a conduit internal surface which defines said passage which releasably retains said in-ear device.

3. The moldable earpiece of claim 2 , wherein said passage defined by said conduit communicates with said first location and said second location on said external surface of said earpiece to align said passage with an ear canal of said ear.

4. The moldable earpiece of claim 2 , wherein said conduit upon heating of said earpiece in said first fixed configuration of said earpiece maintains said passage which releasably retains said in-ear device.

5. The moldable earpiece of claim 2 , wherein said conduit comprises an elastomer layer integral to said earpiece.

6. The moldable earpiece of claim 2 , wherein said conduit comprises a flexible elastomer insert which removably couples to said earpiece.

7. The moldable earpiece of claim 1 , wherein said earpiece maintains said external surface in said first fixed configuration or said second fixed configuration at a temperature below about 40° C. (110° F.) and maintains said earpiece in said moldable condition at a temperature of between about 40° C. (about 110° F.) and about 65° C. (150° F.).

8. The moldable earpiece of claim 7 , wherein said earpiece comprises an amount of polycaprolactone polymer having a number average molecular weight of between about 37,000 grams per mole and about 80,000 grams per mole.

9. The moldable earpiece of claim 8 , wherein said earpiece achieves said moldable condition by heating said earpiece for a period of time within a heated enclosure maintained at about 70° C. (160° F.).

10. The moldable earpiece of claim 8 , wherein said earpiece achieves said moldable condition by exposure of said earpiece for a period of time to an amount of microwave radiation.

11. The moldable earpiece of claim 8 , wherein said earpiece achieves said moldable condition by disposal in an amount of liquid having temperature of between about 40° C. (about 110° F.) and about 65° C. (150° F.).

12. The moldable earpiece of claim 8 , wherein said earpiece achieves said moldable condition by disposal in an amount of liquid, said earpiece disposed in said amount of liquid exposed to an amount of microwave radiation.

13. The moldable earpiece of claim 12 , wherein said amount of liquid comprises an amount of water.

14. The moldable earpiece of claim 1 , wherein said in-ear device is selected from the group consisting of: earphones, earplugs, earbuds, ear tips, ear tubes, ear sealing ballons, and in-ear hearing aids.

15. The moldable earpiece of claim 14 , wherein said in-ear device is a part of an apparatus which resides outside of said ear.

16. The moldable earpiece of claim 15 , wherein said apparatus is selected from the group consisting of: headsets, head phones, telephones, blue tooth headphones, wireless headphones, and hearing aids.