Solid-state imaging apparatus
A solid-state imaging apparatus includes: a solid-state imaging device photoelectrically converting light taken by a lens; and a light shielding member shielding part of light incident on the solid-state imaging device from the lens, wherein an angle made between an edge surface of the light shielding member and an optical axis direction of the lens is larger than an incident angle of light to be incident on an edge portion of the light shielding member.
1. An imaging apparatus comprising;
a lens;
an imaging device that converts incident light through the lens;
a substrate;
a connection portion sealed by a sealing member;
an optical filter disposed over the imaging device; and
a light shielding member that shields part of light incident from the lens;
wherein, the connection portion is configured to electrically connect the imaging device to the substrate, a portion of the light shielding member is disposed at a surface of the optical filter facing the lens, the light shielding member has an opening, a first size of the opening facing the imaging device is greater than a second size of the opening facing the lens, and a side surface that forms an opening of the light shielding member forms an angle with respect to an optical axis direction of the lens.
2. The imaging apparatus according to claim 1 , wherein a virtual extension surface of the surface of the light shielding member does not intersect the substrate.
3. The imaging apparatus according to claim 1 , wherein a virtual extension surface of the surface of the light shielding member does not intersect the sealing member.
4. The imaging apparatus according to claim 1 , wherein the sealing member comprising a resin.
5. The imaging apparatus according to claim 1 , wherein a light receiving surface of the imaging device is exposed in a cavity.
6. The imaging device according to claim 1 , further comprising a cavity disposed between the imaging device and the optical filter.
7. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a portion of a light receiving surface of the imaging device.
8. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a peripheral portion of a light receiving surface of the imaging device.
9. The imaging device according to claim 1 , wherein the optical filter is an infrared ray cut filter.
10. An imaging apparatus comprising;
a lens;
a solid-state imaging device that converts incident light through the lens;
a substrate;
a connection portion sealed by a sealing member;
an optical filter disposed over the imaging device; and
a light shielding member that shields part of light incident from the lens;
wherein, the connection portion is configured to electrically connect the imaging device to the substrate, a portion of the light shielding member is attached to the optical filter facing the imaging device, the light shielding member has an opening, a first size of the opening facing the imaging device is greater than a second size of the opening facing the lens, and a portion of a side surface that forms an opening of the light shielding member forms an angle with respect to an optical axis direction of the lens.
11. The imaging apparatus according to claim 10 , wherein the sealing member comprising a resin.
12. The imaging apparatus according to claim 10 , wherein a light receiving surface of the imaging device is exposed in a cavity.
13. The imaging device according to claim 10 , further comprising a cavity disposed between the imaging device and the optical filter.
14. The imaging device according to claim 10 , wherein the connection portion is electrically connected to a peripheral portion of the imaging device.
15. The imaging device according to claim 10 , wherein the connection portion is electrically connected to a portion of a light receiving surface of the imaging device.
16. The imaging device according to claim 10 , wherein the connection portion is electrically connected to a peripheral portion of a light receiving surface of the imaging device.
17. The imaging device according to claim 10 , wherein the optical filter is an infrared ray cut filter.
18. The imaging device according to claim 1 , wherein the connection portion is electrically connected to a peripheral portion of the imaging device.
19. The imaging device according to claim 18 , wherein the connection portion is electrically connected to a peripheral portion of the substrate.
20. The imaging device according to claim 14 , wherein the connection portion is electrically connected to a peripheral portion of the substrate.
21. The imaging apparatus according to claim 10 , wherein a virtual extension surface of the portion of the side surface of the light shielding member does not intersect the sealing member.
22. The imaging apparatus according to claim 10 , wherein the portion of the side surface that forms the opening is disposed below the optical filter.
23. The imaging apparatus according to claim 21 , wherein a virtual extension surface of the portion of the side surface of the light shielding member does not intersect the substrate.