Resin composition, and prepreg and laminate using the same
The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.
1. A resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second inorganic filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2, and the second inorganic filler (D) has an average particle diameter of 0.3 to 2 μm,
wherein the cyanate ester compound (A) is at least one selected from the group consisting of a naphthol aralkyl-based cyanate ester compound represented by the following general formula (1), a novolac-based cyanate ester compound represented by the following general formula (2), and a biphenyl aralkyl-based cyanate ester compound represented by the following general formula (3):
wherein R each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 50;
wherein R each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 50;
wherein R each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 to 50.
2. The resin composition according to claim 1 , wherein a content ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.03 to 1:0.5.
3. The resin composition according to claim 1 , wherein a total content of the first inorganic filler (C) and the second inorganic filler (D) is 351 to 900 parts by mass based on 100 parts by mass of a total of the cyanate ester compound (A) and the epoxy resin (B).
4. The resin composition according to claim 1 , wherein a total content of the first inorganic filler (C) and the second inorganic filler (D) is 701 to 900 parts by mass based on 100 parts by mass of a total of the cyanate ester compound (A) and the epoxy resin (B).
5. The resin composition according to claim 1 , wherein the first inorganic filler (C) has an average particle diameter of 1.5 to 10 μm.
6. The resin composition according to claim 1 , wherein the second inorganic filler (D) is spherical.
7. The resin composition according to claim 1 , wherein the second inorganic filler (D) is at least one selected from the group consisting of alumina, magnesium oxide, aluminum hydroxide, boron nitride, aggregated boron nitride, silicon nitride, a molybdenum compound, zinc borate, and aluminum nitride.
8. The resin composition according to claim 7 , wherein the second inorganic filler (D) is at least one selected from the group consisting of alumina, magnesium oxide, boron nitride, and aluminum nitride.
9. The resin composition according to claim 1 , wherein the first inorganic filler (C) and the second inorganic filler (D) are contained in an amount of 50% by volume or more and 80% by volume or less in total based on a total volume of the resin composition.
10. The resin composition according to claim 1 , wherein the first inorganic filler (C) is one selected from the group consisting of alumina, magnesium oxide, aluminum hydroxide, boron nitride, aggregated boron nitride, silicon nitride, a molybdenum compound, zinc borate, and aluminum nitride.
11. The resin composition according to claim 10 , wherein the first inorganic filler (C) is one selected from the group consisting of alumina, magnesium oxide, boron nitride, and aluminum nitride.
12. The resin composition according to claim 1 , wherein the cyanate ester compound is the naphthol aralkyl-based cyanate ester compound represented by the above general formula (1).
13. The resin composition according to claim 1 , wherein the cyanate ester compound (A) is contained in an amount of 10 to 90 parts by mass based on 100 parts by mass of the total of the cyanate ester compound (A) and the epoxy resin (B).
14. The resin composition according to claim 1 , further comprising a silane coupling agent (E).
15. The resin composition according to claim 14 , wherein the silane coupling agent is contained in an amount of 3 to 20 parts by mass based on 100 parts by mass of the total of the cyanate ester compound (A) and the epoxy resin (B).
16. The resin composition according to claim 1 , further comprising a maleimide compound (F).
17. The resin composition according to claim 16 , wherein the maleimide compound (F) is contained in an amount of 5 to 75 parts by mass based on 100 parts by mass of a total of the cyanate ester compound (A) and the maleimide compound (F).
18. A prepreg obtained by impregnating or coating a substrate with the resin composition according to claim 1 .
19. A laminate obtained by curing the prepreg according to claim 18 .
20. A metal foil-clad laminate obtained by laminating and curing the prepreg according to claim 18 and metal foil.
21. A printed wiring board comprising an insulating layer and a conductor layer formed on a surface of the insulating layer, wherein
the insulating layer comprises the resin composition according to claim 1 .