Thermoelectric module and heat conversion device using the same
Provided is a thermoelectric module capable of preventing the leakage of a current generated from a connection portion upon connecting a thermoelectric semiconductor element to an electrode by forming an insulating layer having a low heat conductivity on an external surface of the thermoelectric semiconductor element and improving performance of the thermoelectric element by controlling a heat transfer phenomenon from a heating part to a cooling part.
1. A thermoelectric module, comprising:
a first substrate and a second substrate arranged to face each other;
a first semiconductor element and a second semiconductor element arranged between the first substrate and the second substrate;
a first insulating member disposed on an external surface of the first semiconductor element, and the first insulating member having a lower heat conductivity than the first semiconductor element; and
a second insulating member disposed on an external surface of the second semiconductor element, and the second insulating member having a lower heat conductivity than the second semiconductor element,
wherein the second insulating member is spaced apart from the first insulating member, and the first insulating member is composed of different material than the second insulating member.
2. The thermoelectric module of claim 1 , wherein the first insulating member is disposed to be closely attached to the external surface of the first semiconductor element, and the second insulating member is disposed to be closely attached to the external surface of the second semiconductor element.
3. The thermoelectric module of claim 2 , wherein the first insulating member is disposed to entirely surround the external surface of the first semiconductor element, and the second insulating member is disposed to entirely surround the external surface of the second semiconductor element.
4. The thermoelectric module of claim 3 , wherein the first insulating member and the second insulating member are disposed to cover connection portions between the first and second substrates and the first and second semiconductor elements, respectively.
5. The thermoelectric module of claim 4 , wherein the first insulating member and the second insulating member contain any one of an epoxy resin, an SiO-based material, an SiN-based material, an MgO-base material, and a CaO-based material, or a mixture of two or more materials selected from among these materials.
6. The thermoelectric module of claim 1 , wherein the first substrate is a metal substrate, and the second substrate is a metal substrate.
7. The thermoelectric module of claim 6 , wherein the metal substrate has a thickness ranging from 0.1 to 0.5 mm.
8. The thermoelectric module of claim 6 , further comprising
a first dielectric layer on the first substrate, and
a second dielectric layer on the second substrate.
9. The thermoelectric module of claim 8 , wherein the first dielectric layer has a thickness ranging from 0.01 to 0.1 mm.
10. The thermoelectric module of claim 8 , further comprising
a first electrode layer disposed between the first substrate and the first dielectric layer, and
a second electrode layer disposed between the second substrate and the second dielectric layer.
11. The thermoelectric module of claim 10 , wherein the first electrode layer electrically connects the first semiconductor element and the second semiconductor element and has a thickness ranging from 0.01 to 0.3 mm.
12. The thermoelectric module of claim 6 , further comprising a diffusion prevention film at a portion where the first and second semiconductor elements and the first and second substrates are closely attached to each other.
13. The thermoelectric module of claim 1 , wherein the first semiconductor element is a P type semiconductor element, and the second semiconductor element is an N type semiconductor element.
14. The thermoelectric module of claim 13 , wherein a volume of the first substrate is different from a volume of the second substrate.
15. The thermoelectric module of claim 13 , wherein a volume of the second semiconductor element is larger than a volume of the first semiconductor element.
16. The thermoelectric module of claim 14 , wherein an area of the second substrate is larger than an area of the first substrate.
17. The thermoelectric module of claim 16 , wherein the second substrate corresponds to a hot side.
18. A heat conversion device, comprising a thermoelectric module according to claim 1 .