Sensing of mirror position using fringing fields
Mechanical apparatus includes a base and a moving element, which is mounted to rotate about an axis relative to the base. A capacitive rotation sensor includes at least one first electrode disposed on the moving element in a location adjacent to the base and at least one second electrode disposed on the base in proximity to the at least one first electrode. A sensing circuit is coupled to sense a variable capacitance between the first and second electrodes.
1. Mechanical apparatus, comprising:
a base;
a moving element, which is mounted to rotate about an axis relative to the base; and
a capacitive rotation sensor, comprising:
electrodes, including a first electrode disposed on the moving element in a location adjacent to the base and a second electrode disposed on the base in proximity to the first electrode; and
a sensing circuit, which is coupled to sense a variable capacitance between the first electrode and the second electrode, which capacitance varies nonlinearly with an angle of rotation of the moving element, and to measure both a magnitude of the capacitance and a slope of variation of the capacitance with rotation of the moving element, and to apply both the measured magnitude and the measured slope in finding and outputting the angle of rotation as a function of time.
2. The apparatus according to claim 1 , wherein the base defines a plane, and the moving element has a mechanical equilibrium position in the plane, such that the electrodes are coplanar when the moving element is in the mechanical equilibrium position.
3. The apparatus according to claim 1 , wherein the base and the moving element are formed from a semiconductor substrate in a microelectromechanical systems (MEMS) process, and wherein the electrodes and conductive traces connecting the electrodes to the sensing circuit are deposited on the semiconductor substrate as a part of the MEMS process.
4. The apparatus according to claim 1 , wherein the moving element comprises a gimbal, and the base comprises a frame on which the gimbal is mounted.
5. The apparatus according to claim 1 , wherein the moving element comprises a mirror, and the base comprises a gimbal on which the mirror is mounted.
6. The apparatus according to claim 1 , wherein the first electrode and the second electrode have respective shapes that are elongated along a direction perpendicular to the axis about which the moving element rotates.
7. The apparatus according to claim 1 , wherein the first electrode and the second electrode have respective shapes that are elongated along a direction parallel to the axis about which the moving element rotates.
8. The apparatus according to claim 1 , wherein the sensing circuit is configured to make an absolute measurement of an angular position of the moving element based on a location of a central peak in a curve corresponding to the variation of the capacitance with rotation of the moving element and a shape of the curve.
9. A method for sensing, comprising:
mounting a moving element to rotate about an axis relative to a base;
disposing electrodes on the moving element and the base, including a first electrode disposed on the moving element in a location adjacent to the base and a second electrode disposed on the base in proximity to the first electrode;
sensing, using a sensing circuit, a variable capacitance between the first electrode and the second electrode, which capacitance varies nonlinearly with an angle of rotation of the moving element, as the moving element rotates about the axis;
measuring both a magnitude of the capacitance and a slope of variation of the capacitance with rotation of the moving element; and
applying both the measured magnitude and the measured slope in finding and outputting the angle of rotation as a function of time.
10. The method according to claim 9 , wherein the base defines a plane, and the moving element has a mechanical equilibrium position in the plane, such that the electrodes are coplanar when the moving element is in the mechanical equilibrium position.
11. The method according to claim 9 , wherein mounting the moving element comprises forming the base and the moving element from a semiconductor substrate in a microelectromechanical systems (MEMS) process, and wherein disposing the electrodes comprises depositing the electrodes and conductive traces connected to the electrodes on the semiconductor substrate as a part of the MEMS process.
12. The method according to claim 9 , wherein the moving element comprises a gimbal, and the base comprises a frame on which the gimbal is mounted.
13. The method according to claim 9 , wherein the moving element comprises a mirror, and the base comprises a gimbal on which the mirror is mounted.
14. The method according to claim 9 , wherein the electrodes have respective shapes that are elongated along a direction perpendicular to the axis about which the moving element rotates.
15. The method according to claim 9 , wherein the electrodes have respective shapes that are elongated along a direction parallel to the axis about which the moving element rotates.
16. The method according to claim 9 , wherein finding and outputting the angle of rotation comprises making an absolute measurement of an angular position of the moving element based on a location of a central peak in a curve corresponding to the variation of the capacitance with rotation of the moving element and a shape of the curve.