Multilayer ceramic capacitor and board having the same
A multilayer ceramic capacitor includes a body including an active region including first and second internal electrodes, and an upper cover region disposed on the active region, and a lower cover region disposed below the active region. First and second external electrodes are disposed on first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively. At least one stress dispersion pattern occupying an area equal to 30% to 95% of an area of the first or second internal electrode is disposed in the cover region.
1. A multilayer ceramic capacitor comprising:
a body including an active region including a plurality of dielectric layers and first and second internal electrodes alternately disposed with at least one among the plurality of dielectric layers interposed therebetween to be alternately exposed to first and second surfaces of the body in a length direction, respectively, an upper cover region disposed on the active region, and a lower cover region disposed below the active region; and
first and second external electrodes disposed on the first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively, wherein
at least one stress dispersion pattern is disposed in at least one of the upper and lower cover regions, the stress dispersion pattern occupying an area within a range of 30% to 95% of an area of the first or second internal electrode,
the at least one stress dispersion pattern includes first and second stress dispersion patterns alternately disposed in a stacking direction in the at least one of the upper and lower cover regions, and connected to the first and second external electrodes, respectively, and
a length or width of the first and second stress dispersion patterns is increased from an outer portion of the body to a central portion of the body.
2. The multilayer ceramic capacitor of claim 1 , wherein an area of the first and second stress dispersion patterns is increased from the outer portion of the body to the central portion of the body.
3. The multilayer ceramic capacitor of claim 1 , wherein a number of stress dispersion patterns stacked in the upper cover region is the same as a number of stress dispersion patterns stacked in the lower cover region, and the multilayer ceramic capacitor has a vertically symmetrical shape.
4. The multilayer ceramic capacitor of claim 1 , wherein end portions of the first and second stress dispersion patterns overlap each other in the stacking direction.
5. The multilayer ceramic capacitor of claim 1 , wherein lengths of the first and second stress dispersion patterns are equal to or longer than a half of a length of the body.
6. A board having a multilayer ceramic capacitor, the board comprising:
a circuit board on which first and second electrode pads are formed; and
the multilayer ceramic capacitor of claim 1 , mounted on the circuit board so that the first and second external electrodes are disposed on the first and second electrode pads, respectively.
7. A multilayer ceramic capacitor comprising:
a body including an active region including a plurality of dielectric layers and first and second internal electrodes alternately disposed with at least one among the plurality of dielectric layers interposed therebetween to be alternately exposed to first and second surfaces of the body in a length direction, respectively, an upper cover region disposed on the active region, and a lower cover region disposed below the active region; and
first and second external electrodes disposed on the first and second surfaces of the body in the length direction and connected to the first and second internal electrodes, respectively, wherein
at least one stress dispersion pattern is disposed in at least one of the upper and lower cover regions, the stress dispersion pattern occupying an area within a range of 30% to 95% of an area of the first or second internal electrode,
the at least one stress dispersion pattern includes first and second stress dispersion patterns alternately disposed in a stacking direction in the at least one of the upper and lower cover regions, and connected to the first and second external electrodes, respectively, and
an area of the first and second stress dispersion patterns is increased from an outer portion of the body to a central portion of the body.